Datasheet > US3GF

US3GF

更新时间： 2022-02-26 14:38:09

品牌	Logo	应用领域
星合电子 - GXELECTRONICS		/
页数	文件大小	规格书
2页	442K
描述
3.0A SURFACE MOUNT ULTRA-FAST RECTIFIER

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US3GF 数据手册

US3AF THRU US3MF

3.0A SURFACE MOUNT ULTRA-FAST RECTIFIER

SMAF

星合子

XINGHE ELECTRONICS

Features

ꢀ

Glass Passivated Die Construction

Diffused Junction

Ultra-Fast Recovery Time for High Efficiency

Low Forward Voltage Drop, High Current

Capability, and Low Power Loss

Cathode Band

Top View

0.110(2.80)

0.094(2.40)

0.059(1.50)

0.051(1.30)

ꢀ

Surge Overload Rating to 30A Peak

Ideally Suited for Automated Assembly

Plastic Material: UL Flammability

Classification Rating 94V-0

℃

0.150(3.80)

0.128(3.25)

0.012(0.30)

0.006(0.15)

0.055(1.40)

0.035(0.90)

0.047(1.20)

0.028(0.70)

MECHANICAL DATA

• Case: SMAF

• Terminals: Solderable per MIL-STD-750, Method 2026

• Approx. Weight:27mg 0.00086oz

0.199(5.05)

0.179(4.40)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Dimensions in inches and (millimeters)

Ratings at 25℃ ambient temperature unless otherwise specified.

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitive load derate current by 20%.

SYMBOLS US3AF US3BF US3DF US3GF US3JF US3KF US3MF UNIT

Maximum Repetitive Peak Reverse Voltage

Maximum RMS Voltage

V_RRM

V_RMS

V_DC

100

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Volts

Maximum DC Blocking Voltage

100

1000

Maximum Average Forward Rectified Current

At T_L=105℃(NOTE 1)

I_(AV)

3.0

Amps

Peak Forward Surge Current

8.3ms single half sine-wave superimposed on

rated load (JEDEC Method)

I_FSM

V_F

I_R

100

Amps

Volts

µA

Maximum Instantaneous Forward Voltage at 3.0A

1.0

1.3

1.7

T_A= 25℃

Maximum DC Reverse Current

at rated DC Blocking Voltage at

T_A= 125℃

200

Maximum Reverse Recovery Time

Test conditions I_F=0.5A, I_R=1.0A, I_RR=0.25A

t_rr

100

Typical Junction Capacitance

(Measured at 1.0MHz and applied reverse voltage of 4.0V)

C_J

R_θJA

R_θJL

T_J

Typical Thermal Resistance (Note 1)

℃/W

Operating Junction Temperature

Storage Temperature Range

Notes:

℃

(-55 to +150)

T_STG

1. Thermal resistance from Junction to ambient and from junction to lead mounted on

P.C.B. with 0.3×0.3″(8.0 × 8.0mm) copper pad areas.

GAOMI XINGHE ELECTRONICS CO.,LTD.

WWW.SDDZG.COM

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