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UPD70F3102AGJ-33-8EU PDF预览

UPD70F3102AGJ-33-8EU

更新时间: 2024-10-30 20:02:59
品牌 Logo 应用领域
日电电子 - NEC 时钟微控制器外围集成电路
页数 文件大小 规格书
88页 667K
描述
Microcontroller, 32-Bit, FLASH, 33MHz, MOS, PQFP144, 20 X 20 MM, FINE PITCH, PLASTIC, LQFP-144

UPD70F3102AGJ-33-8EU 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:LFQFP,
针数:144Reach Compliance Code:compliant
ECCN代码:3A001.A.3HTS代码:8542.31.00.01
风险等级:5.48具有ADC:YES
地址总线宽度:24位大小:32
最大时钟频率:66.66 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:16
JESD-30 代码:S-PQFP-G144JESD-609代码:e0
长度:20 mmI/O 线路数量:123
端子数量:144最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:NO
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
ROM可编程性:FLASH座面最大高度:1.7 mm
速度:33 MHz最大供电电压:3.6 V
最小供电电压:3 V标称供电电压:3.3 V
表面贴装:YES技术:MOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:20 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

UPD70F3102AGJ-33-8EU 数据手册

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DATA SHEET  
MOS INTEGRATED CIRCUITS  
µPD70F3102A-33  
V850E/MS1TM  
32-BIT SINGLE-CHIP MICROCONTROLLER  
DESCRIPTION  
The µPD70F3102A-33 is a product that substitutes the internal mask ROM of the µPD703102A-33 with flash  
memory. This enables users to perform on-board program writing and erasure, enabling effective evaluation during  
system development, small-lot production of multiple devices, and rapid production start, and quick development and  
time-to-market.  
A version using a 5.0 V power supply for external pins, the µPD70F3102-33, is also available.  
Detailed function descriptions are provided in the following user’s manuals. Be sure to read them before  
designing.  
V850E/MS1 User’s Manual Hardware:  
U12688E  
V850E/MS1, V850E/MS2TM User’s Manual Architecture: U12197E  
FEATURES  
µPD703102A-33 compatible  
Can be replaced by the µPD703102A-33 with internal mask ROM for mass production  
Internal flash memory: 128 KB  
ORDERING INFORMATION  
Part Number  
Package  
µPD70F3102AF1-33-FA1  
µPD70F3102AGJ-33-8EU  
µPD70F3102AGJ-33-UENNote  
157-pin plastic FBGA (14 × 14)  
144-pin plastic LQFP (fine pitch) (20 × 20)  
144-pin plastic LQFP (fine pitch) (20 × 20)  
Note Under development  
The information contained in this document is being issued in advance of the production cycle for the  
device. The parameters for the device may change before final production or NEC Corporation, at its own  
discretion, may withdraw the device prior to its production.  
Not all devices/types available in every country. Please check with local NEC representative for  
availability and additional information.  
Document No. U13845EJ5V0DS00 (5th edition)  
Date Published June 2002 N CP(K)  
Printed in Japan  
The mark shows major revised points.  
©
1998  

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