是否Rohs认证: | 符合 | 生命周期: | Obsolete |
Reach Compliance Code: | compliant | 风险等级: | 5.84 |
位大小: | 32 | CPU系列: | V850 |
JESD-30 代码: | R-PQFP-G100 | JESD-609代码: | e6 |
湿度敏感等级: | 4 | 端子数量: | 100 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | QFP |
封装等效代码: | QFP100,.7X.9 | 封装形状: | RECTANGULAR |
封装形式: | FLATPACK | 电源: | 3.3/5,5 V |
认证状态: | Not Qualified | RAM(字节): | 24576 |
ROM(单词): | 524288 | ROM可编程性: | FLASH |
速度: | 13 MHz | 子类别: | Microcontrollers |
最大压摆率: | 58 mA | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Bismuth (Sn98Bi2) | 端子形式: | GULL WING |
端子节距: | 0.635 mm | 端子位置: | QUAD |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD70F3037H | ETC |
获取价格 |
V850 Series Pamphlet | Pamphlet[02/2002] | |
UPD70F3037HGF-3BA-A | RENESAS |
获取价格 |
32-bit Microcontrollers (Non Promotion), QFP, / | |
UPD70F3037HY | ETC |
获取价格 |
V850 Series Pamphlet | Pamphlet[02/2002] | |
UPD70F3037HYGF-3BA-A | RENESAS |
获取价格 |
32-bit Microcontrollers (Non Promotion), , / | |
UPD70F3038 | ETC |
获取价格 |
V850 Series Pamphlet | Pamphlet[02/2002] | |
UPD70F3038F1-EN2 | NEC |
获取价格 |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PBGA180, 13 X 13 MM, PLASTIC, FBGA-180 | |
UPD70F3038F1-EN2 | RENESAS |
获取价格 |
32-BIT, FLASH, 20MHz, MICROCONTROLLER, PBGA180, 13 X 13 MM, PLASTIC, FBGA-180 | |
UPD70F3038F1-EN2-A | NEC |
获取价格 |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PBGA180, 13 X 13 MM, PLASTIC, LEAD FREE, FBGA- | |
UPD70F3038Y | ETC |
获取价格 |
V850 Family(TM) for Architecture | User's Man | |
UPD70F3038YF1-EN2 | NEC |
获取价格 |
Microcontroller, 32-Bit, FLASH, 20MHz, MOS, PBGA180, 13 X 13 MM, PLASTIC, FBGA-180 |