5秒后页面跳转
UPD46128512F9-CR2 PDF预览

UPD46128512F9-CR2

更新时间: 2022-11-25 16:35:53
品牌 Logo 应用领域
日电电子 - NEC /
页数 文件大小 规格书
82页 817K
描述
128M-BIT CMOS MOBILE SPECIFIED RAM 8M-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION

UPD46128512F9-CR2 数据手册

 浏览型号UPD46128512F9-CR2的Datasheet PDF文件第2页浏览型号UPD46128512F9-CR2的Datasheet PDF文件第3页浏览型号UPD46128512F9-CR2的Datasheet PDF文件第4页浏览型号UPD46128512F9-CR2的Datasheet PDF文件第5页浏览型号UPD46128512F9-CR2的Datasheet PDF文件第6页浏览型号UPD46128512F9-CR2的Datasheet PDF文件第7页 
PRELIMINARY DATA SHEET  
MOS INTEGRATED CIRCUIT  
μPD46128512-X  
128M-BIT CMOS MOBILE SPECIFIED RAM  
8M-WORD BY 16-BIT  
EXTENDED TEMPERATURE OPERATION  
Description  
The μPD46128512-X is a high speed, low power, 134,217,728 bits (8,388,608 words by 16 bits) CMOS Mobile  
Specified RAM featuring asynchronous page read and random write, synchronous burst read/write function.  
The μPD46128512-X is fabricated with advanced CMOS technology using one-transistor memory cell.  
Features  
8,388,608 words by 16 bits organization  
Asynchronous page read mode  
Synchronous read and write mode  
Burst length: 8 words / 16 words / continuous  
Clock latency: 5, 6, 7, 8, 9, 10  
Burst sequence: Linear burst  
Max clock frequency: 108/83 MHz  
Byte data control: /LB (DQ0 to DQ7), /UB (DQ8 to DQ15)  
Low voltage operation: 1.7 to 2.0 V  
Operating ambient temperature: TA = 30 to +85 °C  
Chip Enable input: /CE1 pin  
Standby Mode input: CE2 pin  
Standby Mode 1: Normal standby (Memory cell data hold valid)  
Standby Mode 2: Density of memory cell data hold is variable  
Supply current  
μPD46128512  
Clock  
Asynchronous Operating Operating  
supply ambient  
voltage temperature  
°C  
At operating  
mA  
frequency initial access  
At standby μA  
MHz  
time  
ns  
(MAX.)  
Density of data hold  
128M 32M 16M 8M  
(TYP.)  
(MAX.)  
(MAX.)  
V
Density of data hold  
(MAX.)  
0M 128M 32M 16M 8M  
0M  
bits bits bits bits bits bits bits bits bits bits  
250 T.B.D. T.B.D. T.B.D. 65 80 T.B.D. T.B.D. T.B.D. 15  
-E9X Note  
-E10X Note  
-E11X  
108  
83  
70  
85  
70  
85  
1.7 to 2.0 30 to +85  
60  
50  
60  
50  
-E12X  
Note Under consideration  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. M17507EJ2V0DS00 (2nd edition)  
Date Published September 2005 CP (K)  
Printed in Japan  
The mark  
shows major revised points.  
2005  

与UPD46128512F9-CR2相关器件

型号 品牌 描述 获取价格 数据表
UPD46128512-X NEC 128M-BIT CMOS MOBILE SPECIFIED RAM 8M-WORD BY 16-BIT EXTENDED TEMPERATURE OPERATION

获取价格

UPD46128953-E12X NEC 128M-BIT CMOS MOBILE SPECIFIED RAM 4M-WORD BY 32-BIT ADDRESS / DATA MULTIPLEXED EXTENDED T

获取价格

UPD46128953-E15X NEC 128M-BIT CMOS MOBILE SPECIFIED RAM 4M-WORD BY 32-BIT ADDRESS / DATA MULTIPLEXED EXTENDED T

获取价格

UPD46128953F1-E12X-EB1 RENESAS 暂无描述

获取价格

UPD46128953F1-E12X-EB1 NEC Standard SRAM, 4MX32, CMOS, PBGA127, 13.0 X 11.5 MM, PLASTIC, FBGA-127

获取价格

UPD46128953F1-E15X-EB1 NEC 4MX32 STANDARD SRAM, PBGA127, 13.0 X 11.5 MM, PLASTIC, FBGA-127

获取价格