4
8
5
3
2
7
6
1
REVISIONS
REV.
ZONE
DESCRIPTION
DATE
APPROVED
A.G
.228 5.80
.212 5.40
PIN 30
PIN 16
E
F
PLATING 5 & 6 ADDED
MATING END GAP DIM. ADDED
DRAWING UPDATE
2007/04/05
2008/09/03
2012/03/21
A.G
G
ZLJ
PART NUMBER
(NOT INCLUDING
MATERIAL NOTES
PACKAGEING TYPE)
D
D
.352 8.94
PLASTIC HOUSING:
CONTACTS:
PHOSPHOR BRONZE
HIGH TEMPERATURE RESISTANT PLASTIC
COLOUR: BLACK
FLAMIBILITY RATING UL94V-0
PLATING OPTION 1: (U75 ONLY)
DATE CODE
30μ" [0.76 μm] MIN. GOLD ON MATING
AREA AND 100 - 150μ" [3.81 - 7.62 μm]
MIN. TIN/LEAD (90/10) PLATING ON
TERMINATION OVER 50μ" [1.27 μm]
MIN. NICKEL UNDER LAYER
POSITION #1
INDICATOR
PACKAGING:
TAPE AND REEL RACKAGING
.2126 5.40
.228 5.80
TEMPERATURE RANGE:
-40 C TO +85 C
PLATING OPTION 2: (RoHS FOR UE75 ONLY)
30μ" [0.76 μm] MIN. GOLD ON MATING
AREA AND 2μ" [0.05 μm] GOLD FLASH
PLATING ON TERMINATION OVER 50μ"
[1.27 μm] MIN. NICKEL UNDER LAYER
PIN 1
.591 15.00
+.002
.016
+0.05
-0.10
PLATING OPTION 3: (RoHS FOR UE75 ONLY)
30μ" [0.76 μm] MIN. GOLD ON MATING
AREA AND 100 - 150μ" [3.81 - 7.62 μm]
MIN. LOW WHISKER MATTE TIN PLATING
ON TERMINATION OVER 50μ" [1.27 μm]
MIN. NICKEL UNDER LAYER
.528±.003 13.40±0.08
A
0.41
C
C
-.004
.207 MAX 5.25 MAX
PLATING OPTION 4: (U75 ONLY)
15μ" [0.38 μm] MIN. GOLD ON MATING
AREA AND 100 - 150μ" [3.81 - 7.62 μm]
MIN. TIN/LEAD (90/10) PLATING ON
TERMINATION OVER 50μ" [1.27 μm]
MIN. NICKEL UNDER LAYER
.046 1.16
.106 2.70
B
.043 1.08
.175 4.44
PLATING OPTION 5: (RoHS FOR UE75 ONLY)
15μ" [0.38 μm] MIN. GOLD ON MATING
AREA AND 2μ" [0.05 μm] GOLD FLASH
PLATING ON TERMINATION OVER 50μ"
[1.27 μm] MIN. NICKEL UNDER LAYER
.535 13.60
B
B
PLATING OPTION 6: (RoHS FOR UE75 ONLY)
15μ" [0.38 μm] MIN. GOLD ON MATING
AREA AND 100 - 150μ" [3.81 - 7.62 μm]
MIN. LOW WHISKER MATTE TIN PLATING
ON TERMINATION OVER 50μ" [1.27 μm]
MIN. NICKEL UNDER LAYER
.035 0.90
D
AMPHENOL PART NUMBER CONFIGURATION
UX75 - A 30 - X 0 0 0 T
.055 1.40
.0023 [0.06]
SFP RECEPTALE
CONTACT PLATING (SEE MATERIAL NOTES)
M
S
B A
U75 = NON-RoHS
UE75 = RoHS COMPLIANCE
(FOR U75 NON-RoHS)
1 = PLATING OPTION 1
4 = PLATING OPTION 4
(FOR UE75 RoHS)
2 = PLATING OPTION 2
3 = PLATING OPTION 3
5 = PLATING OPTION 5
6 = PLATING OPTION 6
.055 1.40
C
M
S
S
.0023 [0.06]
B A
C
A
UNLESS OTHERWISE SPECIFIED
APPROVALS
DATE
.010 0.25
0.004 [0.10]
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES ARE:
A
Amphenol Canada Corp.
DRAWN
S
C D
2005/12/02
2005/12/02
J. SI
DECIMALS
ANGLES
TITLE
DESIGNED
CHECKED
QA APPD
IE APP'D
(TYP. 30 SOLDER TAILS)
J.SI
X
XFP 30 POSITION HIGH SPEED
CONNECTOR RECEPTACLE FIXED
BOARD, RIGHT ANGLE SMT
X
MATERIAL AND FINISH
N/A
DO NOT SCALE DRAWING
REF.
SIZE
DWG.
REV.
NO. UX75-A30-X000X
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE
OR USED FOR MANUFACTURING PUPOSES WITHOUT PERMISSION FROM AMPHENOL CANADA CORP.
G
A
CODE IDENT. NO.
DWG APP'D
SCALE
SHEET
PROJECT
03554
NTS
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