uClamp0504A
µClampTM
4-Line ESD protection Array
PROTECTION PRODUCTS - MicroClampTM
Features
Description
The µClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.9mm2 of PCB area and will protect up to four
lines. They are unidirectional devices and may be used
on lines where the signal polarities are above ground.
Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects four I/O lines
Ultra-small SC-89 package (1.7 x 1.7 x 0.6mm)
requires less than 2.9mm2 of PCB area
Working voltage: 5V
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large cross-sec-
tional area junctions for conducting high transient cur-
rents. They offer desirable characteristics for board level
protection including fast response time, low operating
and clamping voltage, and no device degradation.
The uClampTM0504A may be used to meet the immunity
requirements of IEC 61000-4-2, level 4. The small SC-
89 package makes them ideal for use in portable elec-
tronics such as cell phones, PDA’s, notebook comput-
ers, and digital cameras. These devices feature a lead-
free, matte tin lead finish. They are compatible with both
lead free and SnPb assembly techniques.
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
Mechanical Characteristics
SC-89 (SOT-666) package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Weight: 2.9mg (typical)
Lead Finish: Matte Tin
Packaging : Tape and Reel per EIA 481
Applications
Cellular Handsets & Accessories
Cordless Phones
Personal Digital Assistants (PDA’s)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Dimensions
Schematic & PIN Configuration
1.70
0.50
1.25 1.70
0.30
0.60
Maximum Dimensions (mm)
SC-89 (Top View)
www.semtech.com
Revision 06/23/2004
1