是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | TFQFP, TQFP80,.55SQ |
Reach Compliance Code: | compliant | Factory Lead Time: | 12 weeks |
风险等级: | 5.67 | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | S-PQFP-G80 | JESD-609代码: | e4 |
长度: | 12 mm | 湿度敏感等级: | 3 |
端子数量: | 80 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TFQFP | 封装等效代码: | TQFP80,.55SQ |
封装形状: | SQUARE | 封装形式: | FLATPACK, THIN PROFILE, FINE PITCH |
座面最大高度: | 1 mm | 最大供电电流 (Isup): | 100 mA |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 3 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | AUTOMOTIVE | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | QUAD | 宽度: | 12 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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