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UCC27423DGNR PDF预览

UCC27423DGNR

更新时间： 2024-01-27 06:24:00
品牌 Logo 应用领域
德州仪器 - TI 驱动器MOSFET驱动器驱动程序和接口接口集成电路光电二极管信息通信管理
页数 文件大小 规格书
30页 1460K
描述
Dual 4-A High Speed Low-Side MOSFET Drivers With Enable

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UCC27423DGNR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：DIP
包装说明：DIP, DIP8,.3针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1Samacsys Description：UCC27423P, Dual MOSFET Power Driver 4A, Inverting, 4 → 15 V, 8-Pin PDIP
高边驱动器：NO接口集成电路类型：BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码：R-PDIP-T8JESD-609代码：e4
长度：9.81 mm功能数量：2
端子数量：8最高工作温度：105 °C
最低工作温度：-40 °C输出特性：TOTEM-POLE
最大输出电流：4 A标称输出峰值电流：4 A
输出极性：INVERTED封装主体材料：PLASTIC/EPOXY
封装代码：DIP封装等效代码：DIP8,.3
封装形状：RECTANGULAR封装形式：IN-LINE
峰值回流温度（摄氏度）：NOT SPECIFIED电源：4.5/15 V
认证状态：Not Qualified座面最大高度：5.08 mm
子类别：MOSFET Drivers最大压摆率：1.35 mA
最大供电电压：15 V最小供电电压：4.5 V
标称供电电压：14 V表面贴装：NO
技术：BICMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：THROUGH-HOLE
端子节距：2.54 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED断开时间：0.05 µs
接通时间：0.04 µs宽度：7.62 mm

UCC27423DGNR 数据手册

 浏览型号UCC27423DGNR的Datasheet PDF文件第1页浏览型号UCC27423DGNR的Datasheet PDF文件第3页浏览型号UCC27423DGNR的Datasheet PDF文件第4页浏览型号UCC27423DGNR的Datasheet PDF文件第5页浏览型号UCC27423DGNR的Datasheet PDF文件第6页浏览型号UCC27423DGNR的Datasheet PDF文件第7页 
UCC27423, UCC27424, UCC27425  
SLUS545D –NOVEMBER 2002–REVISED MAY 2013  
www.ti.com  
ORDERING INFORMATION  
PACKAGED DEVICES  
OUTPUT  
CONFIGURATION  
TEMPERATURE RANGE  
TA = TJ  
SOIC-8  
(D)(1)  
MSOP-8 PowerPAD  
(DGN)(2)  
PDIP-8  
(P)  
Dual inverting  
–40°C to 125°C  
–40°C to 125°C  
UCC27423D  
UCC27424D  
UCC27423DGN  
UCC27424DGN  
UCC27423P  
UCC27424P  
Dual nonInverting  
One inverting, one  
noninverting  
–40°C to 125°C  
UCC27425D  
UCC27425DGN  
UCC27425P  
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (e.g. UCC27423DR,  
UCC27424DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.  
(2) The PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the  
substrate which is the ground of the device.  
D, DGN, OR P PACKAGE  
(TOP VIEW)  
D, DGN, OR P PACKAGE  
(TOP VIEW)  
D, DGN, OR P PACKAGE  
(TOP VIEW)  
UCC27425  
UCC27424  
UCC27423  
ENBA  
1
8
7
6
5
ENBB  
OUTA  
VDD  
ENBA  
1
8
7
6
5
ENBB  
OUTA  
VDD  
ENBA  
1
8
7
6
5
ENBB  
OUTA  
VDD  
INA 2  
GND 3  
INB 4  
INA 2  
GND 3  
INB 4  
INA 2  
GND 3  
INB 4  
OUTB  
OUTB  
OUTB  
(DUAL INVERTING)  
(DUAL NON-INVERTING)  
(ONE INVERTING AND  
ONE NON-INVERTING)  
POWER DISSIPATION RATING TABLE  
DERATING FACTOR  
POWER RATING (mW)  
TA = 70°C(1)  
PACKAGE  
SUFFIX  
θJC (°C/W)  
θJA (°C/W)  
ABOVE  
70°C (mW/°C)(1)  
SOIC-8  
PDIP-8  
D
P
42  
49  
84 - 160‡  
110  
344–655(2)  
500  
6.25–11.9(2)  
9
MSOP PowerPAD-8(3)  
DGN  
4.7  
50 - 59‡  
1370  
17.1  
(1) 125°C operating junction temperature is used for power rating calculations  
(2) The range of values indicates the effect of pc-board. These values are intended to give the system designer an indication of the best  
and worst case conditions. In general, the system designer should attempt to use larger traces on the pc-board where possible in order  
to spread the heat away form the device more effectively. For information on the PowerPAD™ package, refer to Technical Brief,  
PowerPad Thermally Enhanced Package, Texas Instruments (SLMA002) and Application Brief, PowerPad Made Easy, Texas  
Instruments (SLMA004).  
(3) The PowerPAD™ is not directly connected to any leads of the package. However, it is electrically and thermally connected to the  
substrate which is the ground of the device.  
Table 1. Input/Output Table  
INPUTS (VIN_L, VIN_H)  
UCC27423  
UCC27424  
UCC27425  
ENBA  
ENBB  
INA  
L
INB  
L
OUTA OUTB OUTA OUTB OUTA OUTB  
H
H
H
H
L
H
H
H
H
L
H
H
L
H
L
L
L
L
H
L
H
H
L
L
H
L
L
H
H
L
H
L
H
H
L
H
H
L
H
L
L
H
L
X
X
L
L
L
2
Submit Documentation Feedback  
Copyright © 2002–2013, Texas Instruments Incorporated  
Product Folder Links: UCC27423 UCC27424 UCC27425  
 
 
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UCC27423DGNR 替代型号

型号 品牌 替代类型 描述 数据表
UCC27423DGNG4 TI

功能相似

 Dual 4-A High Speed Low-Side MOSFET Drivers With Enable
UCC27423DGNRG4 TI

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 Dual 4-A High Speed Low-Side MOSFET Drivers With Enable
UCC27423DGN TI

类似代替

 DUAL 4-A HIGH SPEED LOW SIDE MOSFET DRIVERS WITH ENABLE

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