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UCC27423MDREP PDF预览

UCC27423MDREP

更新时间: 2024-02-04 14:23:02
品牌 Logo 应用领域
德州仪器 - TI 驱动器MOSFET驱动器驱动程序和接口接口集成电路光电二极管PC
页数 文件大小 规格书
29页 988K
描述
DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVER WITH ENABLE

UCC27423MDREP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DIP
包装说明:DIP, DIP8,.3针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1Samacsys Description:UCC27423P, Dual MOSFET Power Driver 4A, Inverting, 4 → 15 V, 8-Pin PDIP
高边驱动器:NO接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码:R-PDIP-T8JESD-609代码:e4
长度:9.81 mm功能数量:2
端子数量:8最高工作温度:105 °C
最低工作温度:-40 °C输出特性:TOTEM-POLE
最大输出电流:4 A标称输出峰值电流:4 A
输出极性:INVERTED封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:4.5/15 V
认证状态:Not Qualified座面最大高度:5.08 mm
子类别:MOSFET Drivers最大压摆率:1.35 mA
最大供电电压:15 V最小供电电压:4.5 V
标称供电电压:14 V表面贴装:NO
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED断开时间:0.05 µs
接通时间:0.04 µs宽度:7.62 mm

UCC27423MDREP 数据手册

 浏览型号UCC27423MDREP的Datasheet PDF文件第2页浏览型号UCC27423MDREP的Datasheet PDF文件第3页浏览型号UCC27423MDREP的Datasheet PDF文件第4页浏览型号UCC27423MDREP的Datasheet PDF文件第5页浏览型号UCC27423MDREP的Datasheet PDF文件第6页浏览型号UCC27423MDREP的Datasheet PDF文件第7页 
UCC27424-EP  
UCC27423-EP  
www.ti.com  
SLUS704B FEBRUARY 2007REVISED APRIL 2012  
DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVER WITH ENABLE  
Check for Samples: UCC27424-EP, UCC27423-EP  
1
FEATURES  
2
Industry-Standard Pinout  
SUPPORTS DEFENSE, AEROSPACE  
AND MEDICAL APPLICATIONS  
Enable Functions for Each Driver  
High Current-Drive Capability of ±4 A  
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Unique Bipolar and CMOS True-Drive Output  
Stage Provides High Current at MOSFET Miller  
Thresholds  
Available in Military (–55°C/150°C)  
Temperature Range(1)  
TTL-/CMOS-Compatible Inputs Independent of  
Supply Voltage  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
20-ns Typical Rise and 15-ns Typical Fall  
Times With 1.8-nF Load  
Typical Propagation Delay Times of 25 ns With  
Input Falling and 35 ns With Input Rising  
D OR DGN PACKAGE  
(TOP VIEW)  
4.5-V to 15-V Supply Voltage  
Dual Outputs Can Be Paralleled for Higher  
Drive Current  
1
2
3
4
8
7
6
5
ENBB  
OUTA  
VDD  
ENBA  
INA  
Available in Thermally-Enhanced MSOP  
PowerPAD™ Package With 4.7°C/W θjc  
GND  
INB  
APPLICATIONS  
Switch-Mode Power Supplies  
DC/DC Converters  
OUTB  
Motor Controllers  
Line Drivers  
Class-D Switching Amplifiers  
(1) Custom temperature ranges available  
DESCRIPTION/ORDERING INFORMATION  
The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive  
loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424  
thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to  
improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.  
Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is  
needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and  
MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.  
The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver  
applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the  
industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left  
open for standard operation.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2012, Texas Instruments Incorporated  
 

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