UCC27424-EP
UCC27423-EP
www.ti.com
SLUS704B –FEBRUARY 2007–REVISED APRIL 2012
DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVER WITH ENABLE
Check for Samples: UCC27424-EP, UCC27423-EP
1
FEATURES
2
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Industry-Standard Pinout
SUPPORTS DEFENSE, AEROSPACE
AND MEDICAL APPLICATIONS
Enable Functions for Each Driver
High Current-Drive Capability of ±4 A
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Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Unique Bipolar and CMOS True-Drive Output
Stage Provides High Current at MOSFET Miller
Thresholds
Available in Military (–55°C/150°C)
Temperature Range(1)
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TTL-/CMOS-Compatible Inputs Independent of
Supply Voltage
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Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
20-ns Typical Rise and 15-ns Typical Fall
Times With 1.8-nF Load
Typical Propagation Delay Times of 25 ns With
Input Falling and 35 ns With Input Rising
D OR DGN PACKAGE
(TOP VIEW)
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4.5-V to 15-V Supply Voltage
Dual Outputs Can Be Paralleled for Higher
Drive Current
1
2
3
4
8
7
6
5
ENBB
OUTA
VDD
ENBA
INA
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Available in Thermally-Enhanced MSOP
PowerPAD™ Package With 4.7°C/W θjc
GND
INB
APPLICATIONS
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Switch-Mode Power Supplies
DC/DC Converters
OUTB
Motor Controllers
Line Drivers
Class-D Switching Amplifiers
(1) Custom temperature ranges available
DESCRIPTION/ORDERING INFORMATION
The UCC27423 and UCC27424 high-speed MOSFET drivers can deliver large peak currents into capacitive
loads. Two standard logic options are offered – dual inverting and dual noninverting drivers. The UCC27424
thermally enhanced 8-pin PowerPAD™ MSOP package (DGN) drastically lowers the thermal resistance to
improve long-term reliability. The UCC27423 is offered in a standard SOIC-8 (D) package.
Using a design that inherently minimizes shoot-through current, this driver delivers 4 A of current where it is
needed most – at the Miller plateau region during the MOSFET switching transition. A unique bipolar and
MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.
The UCC27423 and UCC27424 provide enable (ENB) functions to better control the operation of the driver
applications. ENBA and ENBB are implemented on pins 1 and 8, which previously were left unused in the
industry-standard pinout. ENBA and ENBB are pulled up internally to VDD for active-high logic and can be left
open for standard operation.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2012, Texas Instruments Incorporated