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UCC25710DWR PDF预览

UCC25710DWR

更新时间: 2022-04-02 04:27:09
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德州仪器 - TI 控制器
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描述
LLC Half-Bridge Controller For Multi-String LED Lighting

UCC25710DWR 数据手册

 浏览型号UCC25710DWR的Datasheet PDF文件第1页浏览型号UCC25710DWR的Datasheet PDF文件第2页浏览型号UCC25710DWR的Datasheet PDF文件第4页浏览型号UCC25710DWR的Datasheet PDF文件第5页浏览型号UCC25710DWR的Datasheet PDF文件第6页浏览型号UCC25710DWR的Datasheet PDF文件第7页 
UCC25710  
www.ti.com  
SLUSAD7A APRIL 2011REVISED MAY 2011  
THERMAL INFORMATION  
UCC25710  
THERMAL METRIC(1)  
SOIC (DW)  
UNITS  
20 PINS  
79  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
θJCtop  
θJB  
43  
44  
°C/W  
ψJT  
ψJB  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
16  
44  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific  
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
RECOMMENDED OPERATING CONDITIONS  
all voltages are with respect to GND; currents are positive into and negative out of the specified terminal. -40°C < TJ = TA <  
125°C (unless otherwise noted)  
MIN  
11  
TYP  
MAX  
18  
UNIT  
V
VCC  
Operating input voltage  
VCC bypass capacitor  
CVCC  
0.47  
-40  
25  
-
µF  
Operating junction temperature  
Switching frequency at gate drive outputs  
Input voltage range (linear range)  
Input voltage range (using internal clamps)  
VREF bypass capacitor  
SS capacitor  
125  
350  
2.7  
°C  
kHz  
VCREF  
VCREF  
CVREF  
CSS  
0.6  
0
1.65  
1.0  
V
VVREF  
2.2  
0.22  
10  
µF  
nF  
250  
47  
CICOMP  
CDTY  
ICOMP capacitor  
0.5  
0.22  
0
DTY capacitor  
6.8  
µF  
CDSR  
DSR capacitor  
2500  
pF  
Copyright © 2011, Texas Instruments Incorporated  
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Product Folder Link(s): UCC25710  

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