生命周期: | Active | 零件包装代码: | DFP |
包装说明: | FP-16 | 针数: | 16 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 5.69 | Is Samacsys: | N |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-GDFP-F16 | 长度: | 10.16 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 16 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | DFP | 封装等效代码: | FL16,.3 |
封装形状: | RECTANGULAR | 封装形式: | FLATPACK |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 4.5/40 V |
认证状态: | Not Qualified | 筛选级别: | MIL-STD-883 Class B |
座面最大高度: | 2.03 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 15 mA | 最大供电电压 (Vsup): | 40 V |
最小供电电压 (Vsup): | 4.7 V | 标称供电电压 (Vsup): | 10 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子形式: | FLAT |
端子节距: | 1.27 mm | 端子位置: | DUAL |
阈值电压标称: | 2.5 | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 6.731 mm | Base Number Matches: | 1 |
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