Datasheet > U78-B4126-00111

U78-B4126-00111

更新时间： 2024-11-09 19:03:11

品牌	Logo	应用领域
安费诺 - AMPHENOL		连接器
页数	文件大小	规格书
2页	139K
描述
Telecom and Datacom Connector

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

U78-B4126-00111 数据手册

SFP

U77-A4114-2001

U77-A1118-2001

Amphenol’s SFP interconnect system consists of a 20-position connector enclosed in a metal cage mounted

to a host PCB.

Amphenol single port and stacked SFP connectors are rated up to 6 Gbps. They are available in standard

RoHS compliant or non-RoHS compliant versions. The cages have a one-piece construction with enhanced

transceiver mating tabs available in press-ﬁt version and solder tail version. Longer or shorter pins are available

as custom options.

Single Row versions (1xN) consist of SMT connectors used with a separate single row cage (press-ﬁt or solder

tail). Stacked versions (2xN) consist of a 2 row cage with integrated 2 row connectors. The entire assembly is

press-ﬁt compliant pin.

Speciﬁcation Highlights

The interconnect system is comprised of a cage assembly which is used with 20-position

SFP connectors complying with MSA Agreement INF-8074i.

General Characteristics

• RoHS compliant

Materials

• Cage

• Base material: copper alloy

• Industry standard footprint

• Industry standard EIA-364

• Plating: nickel or tin

• Light pipe: optical grade polycarbonate

• Heat sink: aluminum alloy

Mechanical Characteristics

• Accepts multiple transceivers per INF-8074i

• Compliant press-ﬁt pins or solder tails (1x1 cages)

• Durability: 250 mating cycles minimum

• Heat sink clip: stainless steel

• Dust cover: thermoplastic

• EMI ground tabs: stainless steel

• Connector

Electrical Characteristics

• Contact base material: copper alloy

• Contact plating: gold on mating area; gold or matte tin on termination

• Housings: glass reinforced, lead-free solder reﬂow process

compatible thermoplastic, UL94V-0 rated

• Hot swappable

• Operating voltage: 3.3 V

• Operating current: 0.5 A

• Differential impedance: 100 Ω+/- 10 Ω

• DWV: 300 V AC

Temperature Rating

• Insulation resistance: 1000 MΩ min

• Contact resistance: 70 mΩ max

• Spring ﬁngers for superior EMI grounding

• Operating temperature: -55 °C to +85 °C

• Storage temperature: -55 °C to +105 °C

Configurations (Rows x Ports per row)

Packaging

• 1x1

• 2x1

• 1x2

• 2x2

• 1x4

• 2x4

• 1x6

• 2x6

• Tape and reel packaging: connector or 1x1 cage

• Tray packaging: cage of all sizes

• Bulk packaging: dust cover

Options

• Light pipes

• Heat sink (standard ﬁn for ﬁnal cage combo)

• Enhanced EMI performance cage

• Dust cover

1x4 SFP cage with heat sinks

U77-E4124-2041

2x2 SFP Combo

U78-B2127-00121

中文翻译

下载PDF

与U78-B4126-00111相关器件

型号	品牌	获取价格	描述	数据表
U78-B4126-00121	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-00311	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-00411	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-00421	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-00621	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-0D111	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-0D121	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-0D211	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-0D331	AMPHENOL	获取价格	Telecom and Datacom Connector
U78-B4126-0D431	AMPHENOL	获取价格	Telecom and Datacom Connector

与U78-B4126-00111相关文章

英伟达新AI芯片Rubin或提前半年亮相
2024-11-05

22
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
2024-11-05

21
三星深化印度制造布局，供应链本地化进程加速
2024-10-29

48
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
2024-10-29

39

产品中心

服务支持

精选活动

关于我们

帮助中心

U78-B4126-00111

U78-B4126-00111 数据手册

与U78-B4126-00111相关器件

与U78-B4126-00111相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

U78-B4126-00111

U78-B4126-00111 数据手册

与U78-B4126-00111相关器件

与U78-B4126-00111相关文章

您还可以找

您在本页遇到什么问题？