生命周期: | Active | 零件包装代码: | BGA |
包装说明: | BGA, BGA272,20X20,50 | 针数: | 272 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.79 |
其他特性: | ALSO REQUIRES 3.3V SUPPLY | 地址总线宽度: | 64 |
位大小: | 64 | 边界扫描: | YES |
最大时钟频率: | 133 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B272 | 长度: | 27 mm |
低功率模式: | YES | 端子数量: | 272 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA272,20X20,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 1.25,2.5/3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.46 mm |
速度: | 533 MHz | 子类别: | Microprocessors |
最大压摆率: | 3000 mA | 最大供电电压: | 1.32 V |
最小供电电压: | 1.118 V | 标称供电电压: | 1.25 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 宽度: | 27 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TXA105J006P1A | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J006P1C | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J006P1F | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J006P1G | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J020P1A | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J020P1C | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J020P1F | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J020P1G | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J050P1A | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors | |
TXA105J050P1C | CDE |
获取价格 |
Hermetically Sealed Axial Lead Solid Tantalum Capacitors |