是否无铅: | 含铅 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, |
针数: | 64 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | 可调阈值: | NO |
模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT | JESD-30 代码: | S-PBGA-B64 |
长度: | 8 mm | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 64 |
最高工作温度: | 85 °C | 最低工作温度: | -30 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大供电电压 (Vsup): | 4.25 V | 最小供电电压 (Vsup): | 2.85 V |
标称供电电压 (Vsup): | 3.75 V | 表面贴装: | YES |
温度等级: | OTHER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
宽度: | 8 mm | Base Number Matches: | 1 |
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