TSPDMEDA001-5

更新时间： 2024-02-05 20:54:05

品牌	Logo	应用领域
美高森美 - MICROSEMI		/
页数	文件大小	规格书
1页	28K
描述
PRODUCT CAPABILITY SHEET

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中文翻译

获取价格

数据手册

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TSPDMEDA001-5 数据手册

2830 S. Fairview St.

Santa Ana, CA 92704

PH: (714) 979-8220

FAX: (714) 966-5256

PRODUCT

CAPABILITY

SHEET

Performance Advantages

50% real estate reduction over competition

On State Dissipation is 1.5 to 2 times less than competition

Switching Characteristics - (ton) - up to 10 times faster

Monolithic Flip Chip

Thyristor Surge

Protection Device

Array

Can handle 3 times the surge as competition for the same physical area

Custom designs in 3-4 weeks (competition does not offer custom arrangements)

Features

Monolithic Flip Chip Construction, all contacts on one side

Available with solderable surface

Common Anode/Cathode available

for Implantable

Applications

Available in 2, 3, 4, 5, 6, 8 element arrays (see outlines below)

Available in 5-8.5 Volt versions

Power Rating is 50 Joules at 37°C

Also available in TVS (TVSMEDA Series)

Proposed Maximum Ratings @ 37°C-Body Temperature (unless otherwise specified)

Part Number

VDRM

VBO

IBO

ITSM

@ VWM

ton

@ 0V

@1 A @8 A

1kV/us @ 50W

Volts

Volts Volts Volts mA mA Volts Volts Amps

MAX MIN MAX MAX MIN MAX MAX MAX

nsec

MAX

500

MAX

100

MAX

100

TSPDMEDA001-5

TSPDMEDA001-7.5

TSPDMEDA001-8.5

7.5

8.5

100

Monolithic Flip Chip Configurations

(in development)

Elementary

Cell

Schematic

2 mm

Max

Common

Anode

Common

Cathode

These Monolithic Arrays will feature

multiple devices on one chip with all

contacts on one surface. The

surfaces are available with a

solderable metal contact.

Input

2 mm

Max

For more information on these

devices contact Microsemi's Santa

Ana division for custom

configurations and designs.

MSC0988.PDF

中文翻译

下载PDF

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