是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | CGA | 包装说明: | CGA, BGA255,16X16,50 |
针数: | 255 | Reach Compliance Code: | unknown |
ECCN代码: | 3A001.A.2.C | HTS代码: | 8542.31.00.01 |
风险等级: | 5.19 | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 66.7 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-X255 | JESD-609代码: | e0 |
长度: | 21 mm | 低功率模式: | YES |
端子数量: | 255 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | CGA | 封装等效代码: | BGA255,16X16,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
电源: | 2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 3.84 mm | 速度: | 200 MHz |
子类别: | Microprocessors | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | UNSPECIFIED | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 宽度: | 21 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TSPC603RMGU/T10LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU/T12LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU/T14LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU/T6LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU/T8LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU10LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU12LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU14L | ATMEL |
获取价格 |
RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, BGA-255 | |
TSPC603RMGU14LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RMGU6LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |