是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 包装说明: | HBGA, BGA255,16X16,50 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.88 |
Is Samacsys: | N | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 75 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-B255 | JESD-609代码: | e0 |
长度: | 21 mm | 低功率模式: | YES |
端子数量: | 255 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | HBGA | 封装等效代码: | BGA255,16X16,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, HEAT SINK/SLUG |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 2.5,3.3 V |
认证状态: | Not Qualified | 筛选级别: | MIL-PRF-38535 Class Q |
座面最大高度: | 3 mm | 速度: | 300 MHz |
子类别: | Microprocessors | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 21 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TSPC603RVGB/Q14LC | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGB/Q6L | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGB/Q6LC | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGB/Q8L | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGB/Q8LC | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGB/T10LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGB/T12LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGB/T14LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGB/T6LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGB/T8LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |