Datasheet > TSM3C307K010CC6220D493

TSM3C307K010CC6220D493

更新时间： 2023-12-06 20:13:33

品牌	Logo	应用领域
基美 - KEMET		/
页数	文件大小	规格书
13页	1497K
描述
TSM, Tantalum, MnO2 Tantalum, HRA, 300 uF, 10%, 10 VDC, 3C

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Tantalum Surface Mount Capacitors – Low ESR

Tantalum Stack MnO₂(TSM)

Table 2 – Land Dimensions/Courtyard

Density Level A:

Density Level B:

Density Level C:

KEMET Maximum (Most) Land Protrusion Median (Nominal) Land Protrusion Minimum (Least) Land Protrusion

(mm)

Case

TSM2C

2.98

2.74

2.53

9.50

4.50

2.58

2.62

2.73

8.40

4.00

2.20

2.52

2.89

7.54

3.74

TSM2D

TSM2X

TSM3C

TSM3D

TSM3X

TSM4C

TSM4D

TSM4X

TSM6C

TSM6D

TSM6X

3.48

2.98

3.48

2.98

3.48

2.98

3.48

3.24

2.74

3.24

6.04

7.64

6.04

7.64

3.03

2.53

3.03

2.53

3.03

2.53

3.03

11.00

9.50

5.60

4.50

5.60

7.80

3.08

2.58

3.08

2.58

3.08

2.58

3.08

3.12

2.62

3.12

5.92

7.52

5.92

7.52

3.23

2.73

3.23

2.73

3.23

2.73

3.23

9.90

8.40

9.90

8.40

9.90

8.40

9.90

5.10

4.00

5.10

7.30

9.60

7.30

9.60

2.70

2.20

2.70

2.20

2.70

2.20

2.70

3.02

2.52

3.02

5.82

7.42

5.82

7.42

3.39

2.89

3.39

2.89

3.39

2.89

3.39

9.04

7.54

9.04

7.54

9.04

7.54

9.04

4.84

3.74

4.84

7.04

9.34

7.04

9.34

11.00

9.50

11.00

9.50

10.10

7.80

11.00

10.10

Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

¹Height of these chips may create problems in wave soldering.

Grid Placement Courtyard

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

T2021_TSM • 8/18/2023

1...6 7 8910 11 12 13

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