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TSic™ 301
Rapid Response, Low-Cost Temperature Sensor IC with Analog Voltage Output
Data Sheet
temperatureꢀ signal.ꢀ Theꢀ TSicꢀ seriesꢀ includesꢀ
ICsꢀwithꢀtwoꢀlinearꢀanalogꢀsignalꢀoutputꢀoptions,ꢀ
suchꢀasꢀstandardꢀ0~1Voutꢀ(Supplyꢀvoltageꢀ(V+)ꢀ=ꢀ
3.0Vꢀ toꢀ 5.5V)ꢀ orꢀ ratiometricꢀ (10~90%ꢀ ofꢀ supplyꢀ
voltage);ꢀ orꢀ theꢀ digitalꢀ serialꢀ outputꢀ signalꢀ forꢀ
interfacingꢀwithꢀmicrocontrollers.ꢀ
TSic 301 Features
• Lowꢀcost,ꢀprecisionꢀtemperatureꢀsensorꢀ
• Analogꢀ0ꢀtoꢀ1ꢀVoltꢀsignalꢀoutputꢀ
• Resolution:ꢀ0.1°Cꢀ
• Accuracy:ꢀꢀ ±0.3°Cꢀoverꢀspanꢀofꢀ80°Cꢀ
• Wideꢀmeasurementꢀrange:ꢀ–50ꢀtoꢀ+150ꢀ°Cꢀ
Benefits
• Signalꢀreadꢁoutꢀeveryꢀ0.1sꢀ(otherꢀratesꢀ
availableꢀonꢀrequest)ꢀꢀ
• Several accuracy classes available with
100% upward compatibility
• SupplyꢀVoltageꢀ3.0Vꢀtoꢀ5.5V;ꢀhighꢀaccuracyꢀ
operationꢀinꢀrangeꢀ4.5Vꢀtoꢀ5.5Vꢀ
• No calibration by customer needed;
absolute calibration specified
• Package:ꢀ8ꢁpinꢀSOIC,ꢀ3ꢁpinꢀeꢁline,ꢀChipꢀonꢀ
Flexꢀ
• Simple to integrate, reducing cost and time
for application-development
• Lowꢀquiescentꢀcurrentꢀtoꢀminimizeꢀselfꢁheatingꢀ
andꢀpowerꢀconsumptionꢀ
• Fast data measurement – optimal for
temperature control
• Packages for standard SMD, THT or
• Systemꢁonꢁchipꢀbasedꢀonꢀadvancedꢀmixedꢁ
signalꢀCMOSꢀtechnologyꢀintegratingꢀprecisionꢀ
temperatureꢀsensingꢀbandgapꢀreferenceꢀwithꢀ
proportionalꢁtoꢁabsoluteꢁtemperatureꢀ(PTAT)ꢀ
output,ꢀdigitalꢀsignalꢀprocessorꢀ(DSP)ꢀcore,ꢀ
andꢀelectricallyꢀerasableꢀmemoryꢀ(EEPROM)ꢀꢀ
application specific assembly
• Miniaturized solutions with Bare-Chip
(COB, COF, CSP*) or e-line packages –
very fast response time for COF
• Very low power consumption – ideal for
mobile and standard applications
• Field reconfiguration/recalibration option
available (high volume customers only)
• Outstanding long term stability
TSic Family
TheꢀTSicꢀtemperatureꢀsensorꢀICꢀfamilyꢀareꢀfullyꢀ
testedꢀ andꢀ calibratedꢀ sensorsꢀ withꢀ absoluteꢀ
measurementꢀ accuracyꢀ onꢀ deliveryꢀ –ꢀ noꢀ furtherꢀ
calibrationꢀ needed.ꢀ Theꢀ TSicꢀ combinesꢀ
outstandingꢀaccuracyꢀwithꢀlongꢀtermꢀstability,ꢀyetꢀ
itꢀisꢀveryꢀsimpleꢀtoꢀuse.ꢀ
* COB: Chip-On-Board; COF: Chip-On-Flex; CSP: Chip Scale Packaging
TheꢀTSicꢀseriesꢀisꢀspecificallyꢀdesignedꢀforꢀhighꢀ
performance,ꢀcostꢁeffectiveꢀsolutionsꢀforꢀsensingꢀ
temperatureꢀ inꢀ buildingꢀ automation,ꢀ automotive,ꢀ
industrial,ꢀ officeꢀ automation,ꢀ whiteꢀ goodsꢀ andꢀ
Application Support
ForꢀTSicꢀꢀevaluationꢀZMDꢀprovidesꢀaꢀspecialꢀ
EvaluationꢀTool.ꢀ(Ordering Code: TSic Lab Kit ꢀ)
Furtherꢀapplicationꢀsupportꢀisꢀavailableꢀthroughꢀ
lowꢁpower/mobileꢀapplications.
ꢀ
theꢀhotline:
email: tsic@zmd.de
TSicꢀ employsꢀ aꢀ highꢀ precisionꢀ bandgapꢀ
referenceꢀ withꢀ PTATꢀ output;ꢀ aꢀ lowꢁpower,ꢀ
precisionꢀ ADC;ꢀ andꢀ anꢀ onꢁchipꢀ DSPꢀ coreꢀ withꢀ
EEPROMꢀ toꢀ preciselyꢀ calibrateꢀ theꢀ outputꢀ
Phone: +49 351 8822-916
TSicTMꢀ301ꢀDataꢀSheet,ꢀRev.3.6ꢀꢀFebruaryꢀ20,2007ꢀ
Pageꢀ1ꢀofꢀ6ꢀ
©ꢀZMDꢀAGꢀ&ꢀISTꢀAG,ꢀ2007ꢀ
Allꢀrightsꢀreserved.ꢀTheꢀmaterialꢀcontainedꢀhereinꢀmayꢀnotꢀbeꢀreproduced,ꢀadapted,ꢀmerged,ꢀtranslated,ꢀstored,ꢀorꢀusedꢀwithoutꢀtheꢀpriorꢀwrittenꢀ
consentꢀofꢀtheꢀcopyrightꢀowner.
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