是否Rohs认证: | 符合 | 生命周期: | Contact Manufacturer |
包装说明: | DIE, | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.B.1.A | HTS代码: | 8542.32.00.51 |
风险等级: | 5.76 | JESD-30 代码: | R-XUUC-N |
内存密度: | 68719476736 bit | 内存集成电路类型: | FLASH |
内存宽度: | 8 | 功能数量: | 1 |
字数: | 8589934592 words | 字数代码: | 8000000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 组织: | 8GX8 |
封装主体材料: | UNSPECIFIED | 封装代码: | DIE |
封装形状: | RECTANGULAR | 封装形式: | UNCASED CHIP |
峰值回流温度(摄氏度): | NOT SPECIFIED | 编程电压: | 2.7 V |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2.7 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | NO LEAD |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
类型: | NOR TYPE | Base Number Matches: | 1 |
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