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TS5A3359_08

更新时间： 2024-11-09 07:04:59
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德州仪器 - TI 解复用器开关
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26页 884K
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1-Ω SP3T ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 3:1 MULTIPLEXER/DEMULTIPLEXER

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TS5A3359_08 数据手册

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TS5A3359  
1-Ω SP3T ANALOG SWITCH  
5-V/3.3-V SINGLE-CHANNEL 3:1 MULTIPLEXER/DEMULTIPLEXER  
www.ti.com  
SCDS214C–OCTOBER 2005–REVISED JANUARY 2008  
1
FEATURES  
APPLICATIONS  
•
•
•
•
•
•
•
•
•
•
Cell Phones  
PDAs  
2
•
Isolation in Power-Down Mode, V+ = 0  
Specified Break-Before-Make Switching  
Low ON-State Resistance (1 Ω)  
•
•
•
•
•
•
•
•
Portable Instrumentation  
Audio and Video Signal Routing  
Low-Voltage Data Acquisition Systems  
Communication Circuits  
Modems  
Hard Drives  
Computer Peripherals  
Wireless Terminals and Peripherals  
Control Inputs Are 5.5-V Tolerant  
Low Charge Injection  
Excellent ON-State Resistance Matching  
Low Total Harmonic Distortion (THD)  
1.65-V to 5.5-V Single-Supply Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Performance Tested Per JESD 22  
–
2000-V Human-Body Model  
(A114-B, Class II)  
–
1000-V Charged-Device Model (C101)  
FUNCTION TABLE  
COM TO NO,  
NO TO COM  
IN2  
IN1  
L
L
L
H
L
OFF  
COM = NO0  
COM = NO1  
COM = NO2  
H
H
H
DESCRIPTION/ORDERING INFORMATION  
The TS5A3359 is a single-pole triple-throw (SP3T) analog switch that is designed to operate from 1.65 V to  
5.5 V. The device offers a low ON-state resistance and excellent ON-state resistance matching with the  
break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to  
another. The device has an excellent total harmonic distortion (THD) performance and consumes very low  
power. These features make this device suitable for portable audio applications.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
Tape and reel TS5A3359YZPR  
Tape and reel TS5A3359DCUR  
TOP-SIDE MARKING(3)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
_ _ _J9_  
JAL_  
–40°C to 85°C  
VSSOP – DCU  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(3) DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2005–2008, Texas Instruments Incorporated  
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