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TS3V713ELRTGR PDF预览

TS3V713ELRTGR

更新时间: 2024-11-06 12:16:23
品牌 Logo 应用领域
德州仪器 - TI 转换器电平转换器开关
页数 文件大小 规格书
20页 723K
描述
7-CHANNEL, 1:2 VIDEO SWITCH WITH INTEGRATED LEVEL SHIFTERS

TS3V713ELRTGR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC32,.12X.24,16针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.71模拟集成电路 - 其他类型:VIDEO MULTIPLEXER
标称带宽:1300 MHz最大输入电压:5.5 V
最小输入电压:JESD-30 代码:R-PQCC-N32
JESD-609代码:e4长度:6 mm
湿度敏感等级:3正常位置:NO
信道数量:7功能数量:1
端子数量:32标称断态隔离度:40 dB
通态电阻匹配规范:0.2 Ω最大通态电阻 (Ron):1 Ω
最高工作温度:85 °C最低工作温度:-40 °C
输出:SEPARATE OUTPUT封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装等效代码:LCC32,.12X.24,16
封装形状:RECTANGULAR封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:3.3,5 V
认证状态:Not Qualified座面最大高度:0.75 mm
子类别:Multiplexer or Switches最大供电电流 (Isup):0.5 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
最长断开时间:13 ns最长接通时间:11 ns
切换:BREAK-BEFORE-MAKE温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子节距:0.4 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3 mm
Base Number Matches:1

TS3V713ELRTGR 数据手册

 浏览型号TS3V713ELRTGR的Datasheet PDF文件第2页浏览型号TS3V713ELRTGR的Datasheet PDF文件第3页浏览型号TS3V713ELRTGR的Datasheet PDF文件第4页浏览型号TS3V713ELRTGR的Datasheet PDF文件第5页浏览型号TS3V713ELRTGR的Datasheet PDF文件第6页浏览型号TS3V713ELRTGR的Datasheet PDF文件第7页 
TS3V713EL  
www.ti.com  
SCDS312A NOVEMBER 2010REVISED NOVEMBER 2010  
7-CHANNEL, 1:2 VIDEO SWITCH WITH INTEGRATED LEVEL SHIFTERS  
Check for Samples: TS3V713EL  
1
FEATURES  
RTG PACKAGE  
(TOP VIEW)  
Supports 7-channel VGA Signals (R, G, B,  
HSYNC, VSYNC, DDC CLK, and DDC DAT)  
Operating Voltage  
VDD = 3.3 V ±10%  
VDD_5 = 5 V ±10%  
1
2
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
R0  
G0  
R1  
R2  
G1  
G2  
VDD  
B1  
B2  
H1  
H2  
V1  
V2  
High Bandwidth of 1.3 GHz (–3 dB)  
R, G, B Switches  
3
GND  
VDD  
B0  
RON = 4 Ω (Typ.)  
4
5
CON = 8 pF (Typ.)  
GND  
6
H0  
Integrated Level Shifting Buffers for HSYNC and  
VSYNC Channels  
7
V0  
8
N.C.  
SDA0  
SCL0  
GND  
Voltage Clamping NMOS Switches for SCL and  
SDA Channels  
9
10  
11  
ESD Performance (Pins 12–15, 17–22, 24–27)  
±2-kV Contact Discharge (IEC61000-4-2)  
8 kV Human Body Model (JESD22-A114E)  
ESD Performance (All Pins)  
4 kV Human Body Model (JESD22-A114E)  
32-Pin Quad Flat Pack No-Lead (QFN) Package  
The exposed center pad must be  
connected to GND.  
APPLICATIONS  
Notebook Computers  
Docking Stations  
KVM Switches  
DESCRIPTION/ORDERING INFORMATION  
The TS3V713EL is a high bandwidth, 7-channel video multiplexer/demultiplexer for switching between a single  
VGA source and one of two end points. The device is designed for ensuring video signal integrity and minimizing  
video signal attenuation by providing high bandwidth of 1.3 GHz.  
The TS3V713EL has integrated level shifting buffers for the HSYNC and VSYNC signals which provide voltage level  
translation between 3.3V and 5V logic. The SCL and SDA lines use NMOS switches which clamp the output  
voltage to 1 V below VDD  
.
The video signals are protected against ESD with integrated diodes to VDD and GND that support levels up to ±2  
kV Contact Discharge (IEC61000-4-2) and 8 kV Human Body Model (JESD22-A114E).  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
TF713EL  
–40°C to 85°C  
QFN – RTG  
Tape and reel  
TS3V713ELRTGR  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2010, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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