TS3V330
QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH
WITH LOW ON-STATE RESISTANCE
www.ti.com
SCDS162C–MAY 2004–REVISED JULY 2005
FEATURES
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
•
Low Differential Gain and Phase (DG = 0.82%,
DP = 0.1 Degree Typ)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
EN
S1
S2
D
S1
•
•
•
Wide Bandwidth (BW = 300 MHz Min)
Low Crosstalk (XTALK = –80 dB Typ)
IN
CC
S1
A
A
A
B
B
B
S2
D
S1
S2
D
D
Low Power Consumption
(ICC = 10 µA Max)
D
D
•
Bidirectional Data Flow With Near-Zero
Propagation Delay
C
S2
D
C
•
•
Low ON-State Resistance (ron = 3 Ω Typ)
GND
C
Rail-to-Rail Switching on Data I/O Ports
(0 to VCC
)
RGY PACKAGE
(TOP VIEW)
•
•
VCC Operating Range From 3 V to 3.6 V
Ioff Supports Partial-Power-Down Mode
Operation
•
•
•
Data and Control Inputs Provide Undershoot
Clamp Diode
1
16
15
14
13
12
11
10
S1
S2
D
2
EN
S1
A
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
3
A
D
4
A
S2
D
D
S1
S2
D
ESD Performance Tested Per JESD 22
5
B
D
6
B
S1
C
– 2000-V Human-Body Model
(A114-B, Class II)
7
B
S2
C
8
9
– 1000-V Charged-Device Model (C101)
•
Suitable for Both RGB and Composite-Video
Switching
DESCRIPTION/ORDERING INFORMATION
The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable (EN) input.
When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is
disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data
path of the multiplexer/demultiplexer.
Low differential gain and phase make this switch ideal for composite and RGB video applications. This device
has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TS3V330RGYR
TS3V330D
TOP-SIDE MARKING
TF330
QFN – RGY
Tape and reel
Tube
SOIC – D
TS3V330
TF330
Tape and reel
Tape and reel
Tube
TS3V330DR
–40°C to 85°C
SSOP (QSOP) – DBQ
TSSOP – PW
TVSOP – DGV
TS3V330DBQR
TS3V330PW
TF330
Tape and reel
Tape and reel
TS3V330PWR
TS3V330DGVR
TF330
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.