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TS3V330DBQRG4 PDF预览

TS3V330DBQRG4

更新时间: 2024-11-20 06:02:11
品牌 Logo 应用领域
德州仪器 - TI 复用器开关复用器或开关信号电路光电二极管输出元件
页数 文件大小 规格书
26页 762K
描述
QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE

TS3V330DBQRG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:GREEN, PLASTIC, SSOP-16针数:16
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.68Is Samacsys:N
模拟集成电路 - 其他类型:SPDTJESD-30 代码:R-PDSO-G16
JESD-609代码:e4长度:4.9 mm
湿度敏感等级:2信道数量:1
功能数量:4端子数量:16
标称断态隔离度:50 dB最大通态电阻 (Ron):7 Ω
最高工作温度:85 °C最低工作温度:-40 °C
输出:SEPARATE OUTPUT封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP16,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:Multiplexer or Switches最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES最长断开时间:3.5 ns
最长接通时间:6.5 ns切换:BREAK-BEFORE-MAKE
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmBase Number Matches:1

TS3V330DBQRG4 数据手册

 浏览型号TS3V330DBQRG4的Datasheet PDF文件第2页浏览型号TS3V330DBQRG4的Datasheet PDF文件第3页浏览型号TS3V330DBQRG4的Datasheet PDF文件第4页浏览型号TS3V330DBQRG4的Datasheet PDF文件第5页浏览型号TS3V330DBQRG4的Datasheet PDF文件第6页浏览型号TS3V330DBQRG4的Datasheet PDF文件第7页 
TS3V330  
QUAD SPDT WIDE-BANDWIDTH VIDEO SWITCH  
WITH LOW ON-STATE RESISTANCE  
www.ti.com  
SCDS162CMAY 2004REVISED JULY 2005  
FEATURES  
D, DBQ, DGV, OR PW PACKAGE  
(TOP VIEW)  
Low Differential Gain and Phase (DG = 0.82%,  
DP = 0.1 Degree Typ)  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
V
EN  
S1  
S2  
D
S1  
Wide Bandwidth (BW = 300 MHz Min)  
Low Crosstalk (XTALK = –80 dB Typ)  
IN  
CC  
S1  
A
A
A
B
B
B
S2  
D
S1  
S2  
D
D
Low Power Consumption  
(ICC = 10 µA Max)  
D
D
Bidirectional Data Flow With Near-Zero  
Propagation Delay  
C
S2  
D
C
Low ON-State Resistance (ron = 3 Typ)  
GND  
C
Rail-to-Rail Switching on Data I/O Ports  
(0 to VCC  
)
RGY PACKAGE  
(TOP VIEW)  
VCC Operating Range From 3 V to 3.6 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
Data and Control Inputs Provide Undershoot  
Clamp Diode  
1
16  
15  
14  
13  
12  
11  
10  
S1  
S2  
D
2
EN  
S1  
A
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
3
A
D
4
A
S2  
D
D
S1  
S2  
D
ESD Performance Tested Per JESD 22  
5
B
D
6
B
S1  
C
– 2000-V Human-Body Model  
(A114-B, Class II)  
7
B
S2  
C
8
9
– 1000-V Charged-Device Model (C101)  
Suitable for Both RGB and Composite-Video  
Switching  
DESCRIPTION/ORDERING INFORMATION  
The TS3V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer, with a single switch-enable (EN) input.  
When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is  
disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data  
path of the multiplexer/demultiplexer.  
Low differential gain and phase make this switch ideal for composite and RGB video applications. This device  
has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TS3V330RGYR  
TS3V330D  
TOP-SIDE MARKING  
TF330  
QFN – RGY  
Tape and reel  
Tube  
SOIC – D  
TS3V330  
TF330  
Tape and reel  
Tape and reel  
Tube  
TS3V330DR  
–40°C to 85°C  
SSOP (QSOP) – DBQ  
TSSOP – PW  
TVSOP – DGV  
TS3V330DBQR  
TS3V330PW  
TF330  
Tape and reel  
Tape and reel  
TS3V330PWR  
TS3V330DGVR  
TF330  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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