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TS3A226AEYFFR PDF预览

TS3A226AEYFFR

更新时间: 2024-09-09 12:30:27
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德州仪器 - TI 开关
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11页 733K
描述
Autonomous Audio Headset Switch with Reduced GND Switch RON and FM Capability

TS3A226AEYFFR 数据手册

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TS3A226AE  
www.ti.com  
SCDS346A JUNE 2013REVISED JULY 2013  
Autonomous Audio Headset Switch with Reduced GND Switch R and FM Capability  
ON  
Check for Samples: TS3A226AE  
1
FEATURES  
DESCRIPTION  
The TS3A226AE is an audio headset switch that  
detects 3- or 4-pole 3.5mm accessories. For a 4-pole  
accessory with a microphone, the TS3A226AE also  
detects the MIC location and routes the microphone  
and ground signals automatically. The ground signal  
is routed through a pair of low-impedance ground  
FETs (60mtypical), resulting minimal impact on  
audio cross-talk performance. The autonomous  
detection feature allows end users to plug in  
accessories with different audio pole configurations  
into the mobile device and have them operate  
properly with no added software control and  
complexity. The ground FETs of the device are  
designed to allow FM signal pass-through, making it  
possible to use the ground line of the headset as an  
FM antenna in mobile audio application.  
Ground FET Switches (60mΩ typical)  
Autonomous Detection of Headset Types:  
3-Poles or 4-Poles (with MIC on SLEEVE or  
RING2)  
Microphone Line Switches  
Supports FM Signal Transmission Through the  
Ground FETs  
Reduction of Click/Pop Noise  
VDD Range: 2.6 V – 4.7 V  
THD (Mic): 0.002% Typical  
Low Current Consumption: 6.5-µA Typical  
±8kV Contract Discharge (IEC 61000-4-2) ESD  
Performance on SLEEVE and RING2 Pins  
The TS3A226AE is packaged within a 1.2mm ×  
1.2mm WCSP package, making it suitable for use in  
mobile application.  
APPLICATIONS  
Mobile Phones / Tablet PCs  
Notebook/Ultrabook Computers  
TIP  
MIC_BIAS  
RING1  
TS3A226AE  
R1  
Audio  
Codec  
C2  
SLEEVE  
MIC  
MICP  
S1  
RING2  
VDD  
EN  
Control  
Logic  
FET1  
FET2  
GNDA GNDB  
FM Receiver  
Figure 1. Typical Application Diagram  
ORDERING INFORMATION  
For the most current package and ordering information, see the Package Option Addendum at the end of this  
document, or see the TI web site at www.ti.com  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  

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