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TRF371135IRGZT

更新时间: 2024-10-29 07:04:55
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
54页 2105K
描述
INTEGRATED IQ DEMODULATOR

TRF371135IRGZT 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN, LCC48,.27SQ,20针数:48
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:6 weeks
风险等级:0.91JESD-30 代码:S-PQCC-N48
JESD-609代码:e4长度:7 mm
湿度敏感等级:2功能数量:1
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装等效代码:LCC48,.27SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:5 V
认证状态:Not Qualified座面最大高度:1 mm
子类别:Other Telecom ICs标称供电电压:5 V
表面贴装:YES电信集成电路类型:RF AND BASEBAND CIRCUIT
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7 mm

TRF371135IRGZT 数据手册

 浏览型号TRF371135IRGZT的Datasheet PDF文件第2页浏览型号TRF371135IRGZT的Datasheet PDF文件第3页浏览型号TRF371135IRGZT的Datasheet PDF文件第4页浏览型号TRF371135IRGZT的Datasheet PDF文件第5页浏览型号TRF371135IRGZT的Datasheet PDF文件第6页浏览型号TRF371135IRGZT的Datasheet PDF文件第7页 
TRF371135  
www.ti.com  
SLWS220A FEBRUARY 2010REVISED MARCH 2010  
INTEGRATED IQ DEMODULATOR  
Check for Samples: TRF371135  
1
FEATURES  
DESCRIPTION  
2
Frequency Range: 1700 MHz to 6000 MHz  
The TRF371135 is a highly linear and integrated  
direct-conversion quadrature demodulator. The  
TRF371135 integrates balanced I and Q mixers, LO  
buffers, and phase splitters to convert an RF signal  
Integrated Baseband Programmable-Gain  
Amplifier  
On-Chip Programmable Baseband Filter  
High Out-of-Band IP3: 22 dBm at 3550 MHz  
High Out-of-Band IP2: 52 dBm at 3550 MHz  
Hardware and Software Power Down  
Three-Wire Serial Interface  
directly to  
I
and  
Q
baseband. The on-chip  
programmable-gain amplifiers allow adjustment of the  
output signal level without the need for external  
variable-gain (attenuator) devices. The TRF371135  
integrates programmable baseband low-pass filters  
that attenuate nearby interference, eliminating the  
need for an external baseband filter.  
Single Supply: 4.5-V to 5.5-V Operation  
Silicon Germanium Technology  
Housed in a 7-mm × 7-mm QFN package, the  
TRF371135 provides the smallest and most  
APPLICATIONS  
integrated  
high-performance equipment.  
receiver  
solution  
available  
for  
Multicarrier Wireless Infrastructure  
WiMAX  
High-Linearity Direct-Downconversion  
Receiver  
LTE (Long Term Evolution)  
To Microcontroller  
To Microcontroller  
48 47 46 45 44 43 42 41 40 39 38 37  
36  
GNDDIG  
VCCDIG  
CHIP_EN  
1
VCCBBI  
GND  
2
35  
BBIoutn  
3
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
To ADC I  
VCCMIX1  
GND  
4
BBIoutp  
GND  
5
MIXinp  
LOip  
RFin  
6
LOin  
TRF371135  
MIXinn  
GND  
7
LOin  
8
VCCLO  
BBQoutp  
VCCMIX2  
NC  
9
To ADC Q  
10  
11  
12  
BBQoutn  
GND  
NC  
GND  
VCCBBQ  
13 14 15 16 17 18 19 20 21 22 23 24  
30 kW  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010, Texas Instruments Incorporated  
 

TRF371135IRGZT 替代型号

型号 品牌 替代类型 描述 数据表
TRF371135IRGZR TI

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