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TPWR6003PL PDF预览

TPWR6003PL

更新时间: 2023-12-20 18:44:34
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
10页 513K
描述
N-ch MOSFET, 30 V, 0.0006 Ω@10V, DSOP Advance, U-MOSⅨ-H

TPWR6003PL 数据手册

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TPWR6003PL  
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
VDSS  
VGSS  
ID  
30  
(Note 1)  
(Note 2)  
±20  
150  
(Tc = 25 )  
A
(Bottom drain)  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
(Silicon limit)  
(Note 2), (Note 3)  
(Note 2)  
ID  
412  
500  
170  
(t = 100 µs)  
IDP  
PD  
(Tc = 25 )  
W
(Bottom drain)  
Power dissipation  
Power dissipation  
(Note 4)  
(Note 5)  
(Note 6)  
(Note 6)  
PD  
PD  
3.0  
0.96  
Single-pulse avalanche energy  
Single-pulse avalanche current  
Channel temperature  
EAS  
IAS  
468  
mJ  
A
120  
Tch  
Tstg  
175  
Storage temperature  
-55 to 175  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
5. Thermal Characteristics  
Characteristics  
Channel-to-case thermal resistance  
Symbol  
Max  
0.88  
Unit  
Bottom drain  
Rth(ch-c)  
/W  
(Tc = 25 )  
Channel-to-case thermal resistance  
Top source  
Rth(ch-c)  
0.93  
(Tc = 25 )  
Channel-to-ambient thermal resistance  
Channel-to-ambient thermal resistance  
(Note 4)  
(Note 5)  
Rth(ch-a)  
Rth(ch-a)  
50  
156  
Note 1: +20 V/-16 V ensured at DC condition.  
-20 V ensured at pulse condition (duty 5 %).  
Note 2: Ensure that the channel temperature does not exceed 175 .  
Note 3: Limited 150A by package capability.  
Note 4: Device mounted on a glass-epoxy board (a), Figure 5.1  
Note 5: Device mounted on a glass-epoxy board (b), Figure 5.2  
Note 6: VDD = 24 V, Tch = 25 (initial), L = 0.025mH, IAS = 120 A  
Fig. 5.1 Device Mounted on a Glass-Epoxy  
Board (a)  
Fig. 5.2 Device Mounted on a Glass-Epoxy  
Board (b)  
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.  
©2016-2019  
Toshiba Electronic Devices & Storage Corporation  
2019-10-21  
Rev.4.0  
2

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