是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 0.9 | Samacsys Confidence: | |
Samacsys Status: | Released | Samacsys PartID: | 607921 |
Samacsys Pin Count: | 6 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | BGA6C40P2X3_130X93X63 |
Samacsys Released Date: | 2017-01-12 12:59:53 | Is Samacsys: | N |
其他特性: | PFM CONTROL TECHNIQUE IS ALSO POSSIBLE | 模拟集成电路 - 其他类型: | SWITCHING REGULATOR |
控制模式: | VOLTAGE-MODE | 控制技术: | PULSE WIDTH MODULATION |
最大输入电压: | 5.5 V | 最小输入电压: | 2.3 V |
标称输入电压: | 3.6 V | JESD-30 代码: | R-PBGA-B6 |
JESD-609代码: | e1 | 长度: | 1.6 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 6 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流: | 1.2 A |
最大输出电压: | 1.2 V | 最小输出电压: | 1.2 V |
标称输出电压: | 1.2 V | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 0.625 mm |
表面贴装: | YES | 切换器配置: | BUCK |
最大切换频率: | 6600 kHz | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 1.2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TPS62625YFFT | TI |
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