是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA6,2X3,16 | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.81 | 其他特性: | PFM CONTROL TECHNIQUE IS ALSO POSSIBLE |
模拟集成电路 - 其他类型: | SWITCHING REGULATOR | 控制模式: | VOLTAGE-MODE |
控制技术: | PULSE WIDTH MODULATION | 最大输入电压: | 5.5 V |
最小输入电压: | 2.3 V | 标称输入电压: | 3.6 V |
JESD-30 代码: | R-PBGA-B6 | JESD-609代码: | e1 |
长度: | 1.29 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
最大输出电流: | 1.1 A | 标称输出电压: | 1.83 V |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA6,2X3,16 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 0.625 mm |
子类别: | Switching Regulator or Controllers | 表面贴装: | YES |
切换器配置: | BUCK | 最大切换频率: | 6600 kHz |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 0.916 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TPS62620YFFT | TI |
类似代替 |
600-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62600YFFR | TI |
类似代替 |
500-mA, 6-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TPS62601 | TI |
获取价格 |
500-mA, 6-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62601YFF | TI |
获取价格 |
500-mA, 6-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62601YFFR | TI |
获取价格 |
500-mA, 6-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62601YFFT | TI |
获取价格 |
500-mA, 6-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62612 | TI |
获取价格 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI | |
TPS62612YFD | TI |
获取价格 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI | |
TPS62612YFDR | TI |
获取价格 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI | |
TPS62612YFDT | TI |
获取价格 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI | |
TPS62615 | TI |
获取价格 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI | |
TPS62615YFD | TI |
获取价格 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI |