是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | DSBGA-6 | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 0.89 | Samacsys Confidence: | |
Samacsys Status: | Released | Samacsys PartID: | 607903 |
Samacsys Pin Count: | 6 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | BGA6C40P2X3_150X110X40 |
Samacsys Released Date: | 2017-01-12 12:59:53 | Is Samacsys: | N |
模拟集成电路 - 其他类型: | SWITCHING REGULATOR | 控制模式: | VOLTAGE-MODE |
控制技术: | PULSE WIDTH MODULATION | 最大输入电压: | 5.5 V |
最小输入电压: | 2.3 V | 标称输入电压: | 3.6 V |
JESD-30 代码: | R-XBGA-B6 | JESD-609代码: | e1 |
长度: | 1.505 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
最大输出电流: | 1.2 A | 最大输出电压: | 1.2 V |
最小输出电压: | 1.2 V | 标称输出电压: | 1.2 V |
封装主体材料: | UNSPECIFIED | 封装代码: | VFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.4 mm | 表面贴装: | YES |
切换器配置: | BUCK | 最大切换频率: | 6600 kHz |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.105 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TPS62615YFDR | TI |
类似代替 |
350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI |
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TPS62616 | TI |
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350-mA, 6-MHz HIGH-EFFICIENCY STEP-DOWN CONVERTER IN LOW PROFILE CHIP SCALE PACKAGING (HEI | |
TPS62616YFD | TI |
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TPS62616YFDR | TI |
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TPS62617YFDT | TI |
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