TPS62300, TPS62301, TPS62302
TPS62303, TPS62305, TPS62311
CSP-8
QFN-10
TPS62313, TPS62320, TPS62321
www.ti.com
SLVS528B–JULY 2004–REVISED JUNE 2005
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER
IN CHIP SCALE PACKAGING
FEATURES
DESCRIPTION
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Up to 93% Efficiency at 3-MHz Operation
The TPS623xx device is a high-frequency synchron-
ous step-down dc-dc converter optimized for
battery-powered portable applications. Intended for
low-power applications, the TPS623xx supports up to
500-mA load current and allows the use of tiny, low
cost chip inductor and capacitors.
Up to 500-mA Output Current at VI = 2.7 V
3-MHz Fixed Frequency Operation
Best in Class Load and Line Transient
Complete 1-mm Component Profile Solution
-0.5% / +1.3% PWM DC Voltage Accuracy Over
Temperature
The device is ideal for mobile phones and similar
portable applications powered by a single-cell Li-Ion
battery or by 3-cell NiMH/NiCd batteries. With an
output voltage range from 5.4 V down to 0.6 V, the
device supports the low-voltage TMS320™ DSP
family, processors in smart-phones, PDAs as well as
notebooks, and handheld computers.
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35-ns Minimum On-Time
Power-Save Mode Operation at Light Load
Currents
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Fixed and Adjustable Output Voltage
Only 86-µA Quiescent Current
The TPS62300 operates at 3-MHz fixed switching
frequency and enters the power-save mode operation
at light load currents to maintain high efficiency over
the entire load current range. For low noise appli-
cations, the device can be forced into fixed frequency
PWM mode by pulling the MODE/SYNC pin high. The
device can also be synchronized to an external clock
signal in the range of 3 MHz. In the shutdown mode,
the current consumption is reduced to less than 1 µA.
100% Duty Cycle for Lowest Dropout
Synchronizable On the Fly to External
Clock Signal
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Integrated Active Power-Down Sequencing
(TPS6232x only)
Available in a 10-Pin QFN (3 x 3 mm) and
Highly Reliable 8-Pin NanoFree™ and
NanoStar™ (CSP) Packaging
The TPS623xx is available in a 10-pin leadless
package (3 x 3 mm QFN) and an 8-pin chip-scale
package (CSP).
APPLICATIONS
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Cell Phones, Smart-Phones
WLAN and Bluetooth™ Applications
Micro DC-DC Converter Modules
PDAs, Pocket PCs
USB-Based DSL Modems
Digital Cameras
100
V = 3.6 V,
I
90
80
70
60
50
40
30
20
V
= 1.8 V
O
TPS62303YZD
L1
2.7 V . . 6 V
V
A2
B2
B1
D1
C2
D2
O
VIN
EN
SW
1.8 V/500 mA
V
C2
1 µH
I
C1
VOUT
4.7 µF
C1
A1
L = 2.2 µH,
4.7 µF
MODE/SYNC
GND
ADJ
FB
10
0
C
O
= 4.7 µF
0.1
1
10
100
1 k
I
− Load Current − mA
O
Figure 1. Smallest Solution Size Application
(Fixed Output Voltage)
Figure 2. Efficiency vs Load Current
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree, NanoStar, TMS320 are trademarks of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG, Inc.
PowerPAD is a trademark of Texas Instsruments.
UNLESS OTHERWISE NOTED this document contains PRO-
DUCTION DATA information current as of publication date. Prod-
ucts conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 2004–2005, Texas Instruments Incorporated