是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA8,2X4,20 | 针数: | 8 |
Reach Compliance Code: | unknown | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.8 |
其他特性: | PFM CONTROL TECHNIQUE IS ALSO POSSIBLE | 模拟集成电路 - 其他类型: | SWITCHING REGULATOR |
控制模式: | VOLTAGE-MODE | 控制技术: | PULSE WIDTH MODULATION |
最大输入电压: | 6 V | 最小输入电压: | 2.7 V |
标称输入电压: | 3.6 V | JESD-30 代码: | R-XBGA-B8 |
JESD-609代码: | e1 | 长度: | 2.25 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 最大输出电流: | 0.89 A |
标称输出电压: | 1.5 V | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装等效代码: | BGA8,2X4,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 0.625 mm | 子类别: | Switching Regulator or Controllers |
表面贴装: | YES | 切换器配置: | BUCK |
最大切换频率: | 3350 kHz | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.25 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TPS62313 | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62313YZD | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62313YZDR | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62313YZDT | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62315 | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62315YZ | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62315YZR | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62315YZT | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62320 | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING | |
TPS62320DRC | TI |
获取价格 |
500-mA, 3-MHz SYNCHRONOUS STEP-DOWN CONVERTER IN CHIP SCALE PACKAGING |