TPS61310, TPS61311
SLVS978C –MARCH 2010–REVISED NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. AVAILABLE OPTIONS
PART NUMBER(1)
TPS61310YFF
TPS61311YFF
PACKAGE MARKING
TPS61310
PACKAGE
DEVICE SPECIFIC FEATURES(2)
up to 1750 mA (typ.) input valley current
up to 2480 mA (typ.) input valley current
CSP-20
TPS61311
(1) The YFF package is available in tape and reel. Add R suffix (TPS6131xYFFR) to order quantities of 3000 parts per reel, T suffix for 250
parts per reel.
(2) For more details, refer to the section Application Diagrams.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
–0.3 to 7
–0.3 to 7
–0.3 to 7
±25
UNIT
V
Voltage range on AVIN, VOUT, SW, LED1, LED2, LED3(2)
Voltage range on SCL, SDA, STRB0, STRB1, NRESET, GPIO/PG(2)
VI
V
(2)
Voltage range on Tx-MASK, TS
V
Current on GPIO/PG
mA
Power dissipation
Internally limited
–40 to 85
150
(3)
TA
Operating ambient temperature range
Maximum operating junction temperature
Storage temperature range
Human body model
°C
°C
°C
kV
V
TJ (MAX)
Tstg
–65 to 150
2
(4)
ESD rating
Charge device model
500
Machine model
100
V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the
maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)
)
(4) The human body model is a 100-pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
DISSIPATION RATINGS
PACKAGE
THERMAL RESISTANCE(1)
THERMAL RESISTANCE(1)
POWER RATING
TA = 25°C
DERATING FACTOR
ABOVE(2) TA = 25°C
θJA
θJB
YFF
71°C/W
21°C/W
1.4 W
14mW/°C
(1) Simulated with high-K board
(2) Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/ θJA
.
2
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