Typical Size
6,4 mm X 9,7 mm
www.ti.com
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SGLS213A − OCTOBER 2003 − REVISED MAY 2008
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FEATURES
DESCRIPTION
D
Qualified for Automotive Applications
ESD Protection Exceeds 2000 V Per
As a member of the SWIFT family of dc/dc regulators,
the TPS54680 low-input voltage high-output current
synchronous buck PWM converter integrates all
required active components. Using the TRACKIN pin
with other regulators, simultaneous power up and down
are easily implemented. Included on the substrate with
the listed features are a true, high performance, voltage
error amplifier that enables maximum performance and
flexibility in choosing the output filter L and C
components; an under-voltage-lockout circuit to
prevent start-up until the input voltage reaches 3 V; an
internally or externally set slow-start circuit to limit
inrush currents; and a power good output useful for
processor/logic reset.
D
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Power Up/Down Tracking For Sequencing
30-mΩ, 12-A Peak MOSFET Switches for High
Efficiency at 6-A Continuous Output Source
or Sink Current
Wide PWM Frequency:
Fixed 350 kHz or Adjustable 280 kHz to
700 kHz
D
D
D
D
D
Power Good and Enable
Load Protected by Peak Current Limit and
Thermal Shutdown
D
Integrated Solution Reduces Board Area and
Component Count
The TPS54680 is available in a thermally enhanced
28-pin TSSOP (PWP) PowerPAD package, which
eliminates bulky heatsinks. TI provides evaluation
modules and the SWIFT designer software tool to aid
in quickly achieving high-performance power supply
designs to meet aggressive equipment development
cycles.
APPLICATIONS
D
D
Low-Voltage, High-Density Distributed Power
Systems
Point of Load Regulation for High
Performance DSPs, FPGAs, ASICs and
Microprocessors Requiring Sequencing
D
Broadband, Networking and Optical
Communications Infrastructure
{
ORDERING INFORMATION
}
T
J
OUTPUT VOLTAGE
PACKAGE
PART NUMBER
§
−40°C to 125°C
0.9 V to 3.3 V
Plastic HTSSOP (PWP)
TPS54680QPWPRQ1
†
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at http://www.ti.com.
‡
§
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
See the application section of the data sheet for PowerPAD drawing and layout information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD and SWIFT are trademarks of Texas Instruments.
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Copyright 2008, Texas Instruments Incorporated