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TPN3300ANH(TE12L1) PDF预览

TPN3300ANH(TE12L1)

更新时间: 2024-11-05 19:44:15
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
9页 234K
描述
TRANSISTOR,MOSFET,N-CHANNEL,100V V(BR)DSS,21A I(D),LLCC

TPN3300ANH(TE12L1) 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.76
配置:Single最大漏极电流 (Abs) (ID):21 A
FET 技术:METAL-OXIDE SEMICONDUCTOR工作模式:ENHANCEMENT MODE
最高工作温度:150 °C极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):27 W子类别:FET General Purpose Power
表面贴装:YESBase Number Matches:1

TPN3300ANH(TE12L1) 数据手册

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TPN3300ANH  
MOSFETs Silicon N-channel MOS (U-MOS-H)  
TPN3300ANH  
1. Applications  
DC-DC Converters  
Switching Voltage Regulators  
Motor Drivers  
2. Features  
(1) Small, thin package  
(2) High-speed switching  
(3) Small gate charge: QSW = 4.5 nC (typ.)  
(4) Low drain-source on-resistance: RDS(ON) = 28 m(typ.) (VGS = 10 V)  
(5) Low leakage current: IDSS = 10 µA (max) (VDS = 100 V)  
(6) Enhancement mode: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 0.1 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
TSON Advance  
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
VDSS  
VGSS  
ID  
100  
±20  
21  
(Silicon limit)  
(Tc = 25 )  
(t = 1 ms)  
(Note 1), (Note 2)  
(Note 1)  
A
ID  
9.4  
(Note 1)  
IDP  
PD  
38  
(Tc = 25 )  
(t = 10 s)  
27  
W
W
W
mJ  
A
(Note 3)  
(Note 4)  
(Note 5)  
PD  
1.9  
(t = 10 s)  
PD  
0.7  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
Tch  
Tstg  
23  
9.4  
Channel temperature  
Storage temperature  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2012-08-31  
Rev.2.0  
1

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