5秒后页面跳转
捷配首页

Datasheet > 消费电路 > 音频/视频放大器> TPA311DGNG4
TPA311DGNG4 PDF预览

TPA311DGNG4

更新时间： 2024-11-17 03:58:47
品牌 Logo 应用领域
德州仪器 - TI 消费电路商用集成电路音频放大器视频放大器功率放大器光电二极管PC
页数 文件大小 规格书
35页 979K
描述
350-mW MONO AUDIO POWER AMPLIFIER

阅读下载

中文翻译

获取价格

TPA311DGNG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：MSOP
包装说明：HTSSOP, TSSOP8,.19针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：6 weeks
风险等级：1.22Samacsys Confidence：3
Samacsys Status：ReleasedSamacsys PartID：4286
Samacsys Pin Count：9Samacsys Part Category：Integrated Circuit
Samacsys Package Category：Small Outline PackagesSamacsys Footprint Name：DGN (S-PDSO-G8)
Samacsys Released Date：2015-05-08 08:46:34Is Samacsys：N
标称带宽：10 kHz商用集成电路类型：AUDIO AMPLIFIER
谐波失真：0.5%JESD-30 代码：S-PDSO-G8
JESD-609代码：e4长度：3 mm
湿度敏感等级：1信道数量：1
功能数量：1端子数量：8
最高工作温度：85 °C最低工作温度：-40 °C
标称输出功率：0.7 W封装主体材料：PLASTIC/EPOXY
封装代码：HTSSOP封装等效代码：TSSOP8,.19
封装形状：SQUARE封装形式：SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：260电源：3.3/5 V
认证状态：Not Qualified座面最大高度：1.1 mm
子类别：Audio/Video Amplifiers最大压摆率：1.5 mA
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：2.5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.65 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：3 mmBase Number Matches：1

TPA311DGNG4 数据手册

 浏览型号TPA311DGNG4的Datasheet PDF文件第2页浏览型号TPA311DGNG4的Datasheet PDF文件第3页浏览型号TPA311DGNG4的Datasheet PDF文件第4页浏览型号TPA311DGNG4的Datasheet PDF文件第5页浏览型号TPA311DGNG4的Datasheet PDF文件第6页浏览型号TPA311DGNG4的Datasheet PDF文件第7页 
TPA311  
350-mW MONO AUDIO POWER AMPLIFIER  
SLOS207C – JANUARY 1998 – REVISED MAY 2003  
D
D
D
Fully Specified for 3.3-V and 5-V Operation  
D
Shutdown Control  
– I  
– I  
= 7 µA at 3.3 V  
= 60 µA at 5 V  
DD  
DD  
Wide Power Supply Compatibility  
2.5 V – 5.5 V  
D
D
D
D
BTL to SE Mode Control  
Output Power for R = 8 Ω  
L
– 350 mW at V  
– 250 mW at V  
– 250 mW at V  
= 5 V, BTL  
= 5 V, SE  
Integrated Depop Circuitry  
DD  
DD  
DD  
Thermal and Short-Circuit Protection  
= 3.3 V, BTL  
= 3.3 V, SE  
Surface Mount Packaging  
– SOIC  
– PowerPAD MSOP  
– 75 mW at V  
DD  
D OR DGN PACKAGE  
(TOP VIEW)  
description  
The TPA311 is a bridge-tied load (BTL) or  
single-ended (SE) audio power amplifier devel-  
oped especially for low-voltage applications  
where internal speakers and external earphone  
operation are required. Operating with a 3.3-V  
supply, the TPA311 can deliver 250-mW of  
SHUTDOWN  
BYPASS  
SE/BTL  
IN  
V –  
O
GND  
1
2
3
4
8
7
6
5
V
DD  
V +  
O
continuous power into a BTL 8-Ω load at less than 1% THD+N throughout voice band frequencies. Although  
this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as  
cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the  
output in most applications, which is particularly important for small battery-powered equipment. A unique  
feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive  
is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load.  
This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually  
eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an  
8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by  
50% and height by 40%.  
V
DD  
6
R
F
V
DD  
/2  
C
Audio  
Input  
S
R
I
IN  
4
2
C
V
O
+
C
5
–
+
C
I
BYPASS  
C
BF  
SHUTDOWN  
SE/BTL  
1
3
350 mW  
–
+
V
O
–
8
From System Control  
From HP Jack  
Bias  
Control  
7
GND  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
Copyright 1998 – 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...35

中文翻译

下载PDF

TPA311DGNG4 替代型号

型号 品牌 替代类型 描述 数据表
TPA321DGN TI

完全替代

 350-mW MONO AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS
TPA6205A1DGN TI

类似代替

 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER WITH 1.8-V INPUT LOGIC THRESHOLDS
TPA301DGN TI

类似代替

 350-mW MONO AUDIO POWER AMPLIFIER

与TPA311DGNG4相关器件

型号 品牌 获取价格 描述 数据表
TPA311DGNR TI

获取价格

 		Single Audio Amplifier
TPA311DGNRG4 TI

获取价格

 		350-mW MONO AUDIO POWER AMPLIFIER
TPA311DR TI

获取价格

 		Single Audio Amplifier
TPA311DRG4 TI

获取价格

 		350-mW MONO AUDIO POWER AMPLIFIER
TPA311GPLFG ITT

获取价格

 		Navigation Tact Switch for SMT
TPA311GPLFS ITT

获取价格

 		Navigation Tact Switch for SMT
TPA311GPLFS CK-COMPONENTS

获取价格

 		Multidirection SMT Navigation Switch
TPA3120D2 TI

获取价格

 		25-W STEREO CLASS-D AUDIO POWER AMPLIFIER
TPA3120D2_07 TI

获取价格

 		25-W STEREO CLASS-D AUDIO POWER AMPLIFIER
TPA3120D2PWP TI

获取价格

 		25-W STEREO CLASS-D AUDIO POWER AMPLIFIER

与TPA311DGNG4相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证