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TPA6205A1DGN PDF预览

TPA6205A1DGN

更新时间: 2024-11-18 03:58:47
品牌 Logo 应用领域
德州仪器 - TI 放大器功率放大器输入元件
页数 文件大小 规格书
24页 912K
描述
1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER WITH 1.8-V INPUT LOGIC THRESHOLDS

TPA6205A1DGN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:MSOP
包装说明:HTSSOP, TSSOP8,.19针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01Factory Lead Time:1 week
风险等级:1.76Samacsys Description:Texas Instruments,TPA6205A1DGN,IC,Audio Texas Instruments TPA6205A1DGN Audio Amplifier IC, Class-AB Mono -70dB, 8-Pin MSOP
标称带宽:20 kHz商用集成电路类型:AUDIO AMPLIFIER
谐波失真:1%JESD-30 代码:S-PDSO-G8
JESD-609代码:e4长度:3 mm
湿度敏感等级:1标称噪声指数:104 dB
信道数量:1功能数量:1
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C标称输出功率:1.25 W
封装主体材料:PLASTIC/EPOXY封装代码:HTSSOP
封装等效代码:TSSOP8,.19封装形状:SQUARE
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:3/5 V认证状态:Not Qualified
座面最大高度:1.1 mm子类别:Audio/Video Amplifiers
最大压摆率:2 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3 mm

TPA6205A1DGN 数据手册

 浏览型号TPA6205A1DGN的Datasheet PDF文件第2页浏览型号TPA6205A1DGN的Datasheet PDF文件第3页浏览型号TPA6205A1DGN的Datasheet PDF文件第4页浏览型号TPA6205A1DGN的Datasheet PDF文件第5页浏览型号TPA6205A1DGN的Datasheet PDF文件第6页浏览型号TPA6205A1DGN的Datasheet PDF文件第7页 
TPA6205A1  
ZQV  
DRB  
DGN  
www.ti.com  
SLOS490AJULY 2006REVISED AUGUST 2006  
1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER WITH 1.8-V INPUT  
LOGIC THRESHOLDS  
FEATURES  
APPLICATIONS  
Designed for Wireless Handsets, PDAs, and  
other mobile devices  
1.25 W Into 8From a 5-V Supply at  
THD = 1% (Typical)  
Compatible with Low Power (1.8V Logic) I/O  
Threshold control signals  
Shutdown Pin has 1.8V Compatible  
Thresholds  
Low Supply Current: 1.7mA Typical  
Shutdown Current < 10µA  
DESCRIPTION  
The TPA6205A1 is a 1.25-W mono fully differential  
amplifier designed to drive a speaker with at least  
8-impedance while consuming less than 37 mm2  
(ZQV package option) total printed-circuit board  
(PCB) area in most applications. This device  
operates from 2.5 V to 5.5 V, drawing only 1.7 mA of  
quiescent supply current. The TPA6205A1 is  
available in the space-saving 2 mm x 2 mm  
MicroStar Junior™ BGA package, and the space  
saving 3 mm x 3 mm QFN (DRB) package.  
Only Five External Components  
– Improved PSRR (90 dB) and Wide Supply  
Voltage (2.5V to 5.5V) for Direct Battery  
Operation  
– Fully Differential Design Reduces RF  
Rectification  
– Improved CMRR Eliminates Two Input  
Coupling Capacitors  
– C(BYPASS) Is Optional Due to Fully  
Differential Design and High PSRR  
Features like 85-dB PSRR from 90 Hz to 5 kHz,  
improved RF-rectification immunity, and small PCB  
area makes the TPA6205A1 ideal for wireless  
handsets. A fast start-up time of 4 µs with minimal  
pop makes the TPA6205A1 ideal for PDA  
applications.  
Available in 3 mm x 3 mm QFN Package  
(DRB)  
Available in an 8-Pin PowerPAD™ MSOP  
(DGN)  
Avaliable in a 2 mm x 2 mm MicroStar  
Junior™ BGA Package (ZQV)  
APPLICATION CIRCUIT  
Actual Solution Size  
V
DD  
R
F
To Battery  
R
F
C
s
R
I
-
IN-  
C
V
_
+
O+  
S
(1)  
C
B
In From  
DAC  
5,25 mm  
R
I
V
O-  
+
IN+  
R
I
R
I
R
F
GND  
SHUTDOWN  
Bias  
Circuitry  
R
F
6,9 mm  
C BYPASS  
(
)
(Optional)  
Applies to the ZQV Packages Only  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD, MicroStar Junior are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006, Texas Instruments Incorporated  

TPA6205A1DGN 替代型号

型号 品牌 替代类型 描述 数据表
TPA6205A1DGNR TI

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