是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
Reach Compliance Code: | not_compliant | 风险等级: | 5.92 |
位大小: | 8 | CPU系列: | TMS370 |
JESD-30 代码: | S-XQCC-J68 | 端子数量: | 68 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | CERAMIC | 封装代码: | QCCJ |
封装等效代码: | LDCC68,1.0SQ | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER | 电源: | 5 V |
认证状态: | Not Qualified | RAM(字节): | 512 |
ROM(单词): | 16384 | ROM可编程性: | UVPROM |
速度: | 5 MHz | 子类别: | Microcontrollers |
最大压摆率: | 95 mA | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | QUAD |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TMX370C756FZS | ETC |
获取价格 |
8-Bit Microcontroller | |
TMX370C810FNA | TI |
获取价格 |
IC,MICROCONTROLLER,8-BIT,TMS370 CPU,CMOS,LDCC,28PIN,PLASTIC | |
TMX370C810NA | TI |
获取价格 |
IC,MICROCONTROLLER,8-BIT,TMS370 CPU,CMOS,DIP,28PIN,PLASTIC | |
TMX370C850FNS | TI |
获取价格 |
IC,MICROCONTROLLER,8-BIT,TMS370 CPU,CMOS,LDCC,68PIN,PLASTIC | |
TMX380SRAFNL | ETC |
获取价格 |
Communications Interface | |
TMX388K060P0B5 | VISHAY |
获取价格 |
CAPACITOR, TANTALUM, NON SOLID, POLARIZED, 60V, 3800uF, THROUGH HOLE MOUNT, RADIAL LEADED | |
TMX388M030P0A5 | VISHAY |
获取价格 |
CAPACITOR, TANTALUM, NON SOLID, POLARIZED, 30V, 3800uF, THROUGH HOLE MOUNT, RADIAL LEADED | |
TMX3C6411GLZ300 | TI |
获取价格 |
FIXED-POINT DIGITAL SIGNAL PROCESSORS | |
TMX3C6411GLZ5E0 | TI |
获取价格 |
FIXED-POINT DIGITAL SIGNAL PROCESSORS | |
TMX3C6411GLZA300 | TI |
获取价格 |
FIXED-POINT DIGITAL SIGNAL PROCESSORS |