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TMS370C020AFNA PDF预览

TMS370C020AFNA

更新时间: 2024-11-06 12:05:55
品牌 Logo 应用领域
德州仪器 - TI 微控制器
页数 文件大小 规格书
61页 833K
描述
8-BIT MICROCONTROLLER

TMS370C020AFNA 技术参数

生命周期:Obsolete零件包装代码:LCC
包装说明:QCCJ, LDCC44,.7SQ针数:44
Reach Compliance Code:unknownHTS代码:8542.31.00.01
风险等级:5.84具有ADC:NO
地址总线宽度:位大小:8
边界扫描:NOCPU系列:TMS370
最大时钟频率:20 MHzDAC 通道:NO
DMA 通道:NO外部数据总线宽度:
格式:FIXED POINT集成缓存:NO
JESD-30 代码:S-PQCC-J44长度:16.585 mm
低功率模式:YESDMA 通道数量:
外部中断装置数量:3I/O 线路数量:34
串行 I/O 数:2端子数量:44
计时器数量:1片上数据RAM宽度:8
片上程序ROM宽度:8最高工作温度:85 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:QCCJ
封装等效代码:LDCC44,.7SQ封装形状:SQUARE
封装形式:CHIP CARRIER电源:5 V
认证状态:Not QualifiedRAM(字节):256
RAM(字数):256ROM(单词):4096
ROM可编程性:MROM座面最大高度:4.57 mm
速度:5 MHz子类别:Microcontrollers
最大压摆率:45 mA最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
宽度:16.585 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER
Base Number Matches:1

TMS370C020AFNA 数据手册

 浏览型号TMS370C020AFNA的Datasheet PDF文件第2页浏览型号TMS370C020AFNA的Datasheet PDF文件第3页浏览型号TMS370C020AFNA的Datasheet PDF文件第4页浏览型号TMS370C020AFNA的Datasheet PDF文件第5页浏览型号TMS370C020AFNA的Datasheet PDF文件第6页浏览型号TMS370C020AFNA的Datasheet PDF文件第7页 
TMS370Cx2x  
8-BIT MICROCONTROLLER  
SPNS018C – FEBRUARY 1993 – REVISED FEBRUARY 1997  
FN AND FZ PACKAGES  
(TOP VIEW)  
CMOS/EEPROM/EPROM Technologies on  
a Single Device  
– Mask-ROM Devices for High-Volume  
Production  
– One-Time-Programmable (OTP) EPROM  
Devices for Low-Volume Production  
– Reprogrammable-EPROM Devices for  
Prototyping Purposes  
Internal System Memory Configurations  
– On-Chip Program Memory Versions  
– ROM: 4K or 8K Bytes  
6
5
4
3
2
1 44 43 42 41 40  
39  
MC  
INT1  
INT2  
INT3  
7
8
9
XTAL2/CLKIN  
XTAL1  
T1IC/CR  
T1PWM  
T1EVT  
NC  
SPISOMI  
SPISIMO  
SPICLK  
NC  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
V
10  
11  
12  
13  
14  
15  
16  
17  
CC  
NC  
A7  
A6  
V
SS  
A5  
A4  
A3  
– EPROM: 8K Bytes  
– Data EEPROM: 256 Bytes  
18 19 20 21 22 23 24 25 26 27 28  
– Static RAM: 256 Bytes Usable as  
Registers  
Flexible Operating Features  
– Low-Power Modes: STANDBY and HALT  
– Commercial, Industrial, and Automotive  
Temperature Ranges  
JC, JD, N AND NJ PACKAGES  
(TOP VIEW)  
B2  
B3  
B4  
1
2
3
4
5
6
7
8
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
B1  
B0  
SCITXD  
SCIRXD  
SCICLK  
D5  
– Clock Options  
C0  
RESET  
INT1  
INT2  
INT3  
– Divide-by-1 (2 MHz–5 MHz SYSCLK) PLL  
– Divide-by-4 (0.5 MHz–5 MHz SYSCLK)  
MC  
XTAL2/CLKIN  
XTAL1  
T1IC/CR  
T1PWM  
T1EVT  
SPISOMI  
SPISIMO  
SPICLK  
B7  
B6  
B5  
D6  
D3  
– Supply Voltage (V ) 5 V ±10%  
CC  
V
9
CC  
A7  
A6  
16-Bit General-Purpose Timer  
– Software Configurable as  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
V
SS  
A5  
a 16-Bit Event Counter, or  
A4  
A3  
A2  
A1  
A0  
D7  
D4  
a 16-Bit Pulse Accumulator, or  
a 16-Bit Input Capture Function, or  
Two Compare Registers, or a  
Self-Contained Pulse-Width-Modulation  
(PWM) Function  
– Software Programmable Input Polarity  
– 8-Bit Prescaler, Providing a 24-Bit  
Real-Time Timer  
On-Chip 24-Bit Watchdog Timer  
– Mask-ROM Devices: Hard Watchdog,  
Simple Counter, or Standard Watchdog  
Flexible Interrupt Handling  
Serial Peripheral Interface (SPI)  
Serial Communications Interface 1 (SCI1)  
TMS370 Series Compatibility  
– Register-to-Register Architecture  
– 128 or 256 General-Purpose Registers  
– 14 Powerful Addressing Modes  
– Instructions Upwardly Compatible With  
All TMS370 Devices  
CMOS/TTL Compatible I/O Pins/Packages  
– All Peripheral Function Pins Software  
Configurable for Digital I/O  
– 33 Bidirectional Pins, 1 Input Pin  
– 44-Pin Plastic and Ceramic Leaded Chip  
Carrier (LCC) Packages  
– 40-Pin Plastic and Ceramic Dual-In-Line  
(DIP) Packages  
Workstation/PC-Based Development  
System  
– C Compiler and C Source Debugger  
– Real-Time In-Circuit Emulation  
– Extensive Breakpoint/Trace Capability  
– Multi-Window User Interface  
– Microcontroller Programmer  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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