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TMS320F28335PGF PDF预览

TMS320F28335PGF

更新时间: 2024-11-26 02:40:03
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
208页 6019K
描述
TMS320F2833x, TMS320F2823x Digital Signal Controllers (DSCs)

TMS320F28335PGF 数据手册

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TMS320F28335, TMS320F28335-Q1, TMS320F28334, TMS320F28333  
TMS320F28332, TMS320F28235, TMS320F28235-Q1  
TMS320F28234, TMS320F28234-Q1,TMS320F28232,TMS320F28232-Q1
SPRS439P – JUNE 2007 – REVISED FEBRUARY 2021  
TMS320F2833x, TMS320F2823x Digital Signal Controllers (DSCs)  
(6 for eCAPs and 2 for eQEPs)  
– Up to 9 16-bit timers  
(6 for ePWMs and 3 XINTCTRs)  
Three 32-bit CPU timers  
Serial port peripherals  
– Up to 2 CAN modules  
– Up to 3 SCI (UART) modules  
– Up to 2 McBSP modules (configurable as SPI)  
– One SPI module  
– One Inter-Integrated Circuit (I2C) bus  
12-bit ADC, 16 channels  
1 Features  
High-performance static CMOS technology  
– Up to 150 MHz (6.67-ns cycle time)  
– 1.9-V/1.8-V core, 3.3-V I/O design  
High-performance 32-bit CPU (TMS320C28x)  
– IEEE 754 single-precision Floating-Point Unit  
(FPU) (F2833x only)  
– 16 × 16 and 32 × 32 MAC operations  
– 16 × 16 dual MAC  
– Harvard bus architecture  
– Fast interrupt response and processing  
– Unified memory programming model  
– Code-efficient (in C/C++ and Assembly)  
Six-channel DMA controller (for ADC, McBSP,  
ePWM, XINTF, and SARAM)  
16-bit or 32-bit External Interface (XINTF)  
– More than 2M × 16 address reach  
On-chip memory  
– F28335, F28333, F28235:  
256K × 16 flash, 34K × 16 SARAM  
– F28334, F28234:  
128K × 16 flash, 34K × 16 SARAM  
– F28332, F28232:  
64K × 16 flash, 26K × 16 SARAM  
– 1K × 16 OTP ROM  
– 80-ns conversion rate  
– 2 × 8 channel input multiplexer  
– Two sample-and-hold  
– Single/simultaneous conversions  
– Internal or external reference  
Up to 88 individually programmable, multiplexed  
GPIO pins with input filtering  
JTAG boundary scan support  
– IEEE Standard 1149.1-1990 Standard Test  
Access Port and Boundary Scan Architecture  
Advanced emulation features  
– Analysis and breakpoint functions  
– Real-time debug using hardware  
Development support includes  
– ANSI C/C++ compiler/assembler/linker  
– Code Composer StudioIDE  
– DSP/BIOSand SYS/BIOS  
– Digital motor control and digital power software  
libraries  
Low-power modes and power savings  
– IDLE, STANDBY, HALT modes supported  
– Disable individual peripheral clocks  
Endianness: Little endian  
Boot ROM (8K × 16)  
– With software boot modes (through SCI, SPI,  
CAN, I2C, McBSP, XINTF, and parallel I/O)  
– Standard math tables  
Clock and system control  
– On-chip oscillator  
– Watchdog timer module  
GPIO0 to GPIO63 pins can be connected to one of  
the eight external core interrupts  
Peripheral Interrupt Expansion (PIE) block that  
supports all 58 peripheral interrupts  
128-bit security key/lock  
– Protects flash/OTP/RAM blocks  
– Prevents firmware reverse-engineering  
Enhanced control peripherals  
– Up to 18 PWM outputs  
– Up to 6 HRPWM outputs with 150-ps MEP  
resolution  
– Up to 6 event capture inputs  
– Up to 2 Quadrature Encoder interfaces  
– Up to 8 32-bit timers  
Package options:  
– Lead-free, green packaging  
– 176-ball plastic Ball Grid Array (BGA) (ZJZ)  
– 179-ball MicroStar BGA(ZHH)  
– 176-pin Low-Profile Quad Flatpack (LQFP)  
(PGF)  
– 176-pin Thermally Enhanced Low-Profile Quad  
Flatpack (HLQFP) (PTP)  
Temperature options:  
– A: –40°C to 85°C (PGF, ZHH, ZJZ)  
– S: –40°C to 125°C (PTP, ZJZ)  
– Q: –40°C to 125°C (PTP, ZJZ)  
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 

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