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TMS320DM6446 PDF预览

TMS320DM6446

更新时间： 2024-01-02 01:35:15
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德州仪器 - TI /
页数 文件大小 规格书
231页 1809K
描述
Digital Media System-on-Chip

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TMS320DM6446 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：BGA
包装说明：LFBGA, BGA361,19X19,32针数：361
Reach Compliance Code：unknownHTS代码：8542.31.00.01
Factory Lead Time：1 week风险等级：5.05
其他特性：DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ ,32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY位大小：32
格式：FIXED POINTJESD-30 代码：S-PBGA-B361
长度：16 mm湿度敏感等级：3
端子数量：361最高工作温度：85 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：LFBGA封装等效代码：BGA361,19X19,32
封装形状：SQUARE封装形式：GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260电源：1.2,1.8,3.3 V
认证状态：Not QualifiedRAM（字数）：16384
座面最大高度：1.4 mm子类别：Digital Signal Processors
最大供电电压：1.26 V最小供电电压：1.14 V
标称供电电压：1.2 V表面贴装：YES
技术：CMOS温度等级：OTHER
端子形式：BALL端子节距：0.8 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：16 mmuPs/uCs/外围集成电路类型：MICROPROCESSOR CIRCUIT
Base Number Matches：1

TMS320DM6446 数据手册

 浏览型号TMS320DM6446的Datasheet PDF文件第2页浏览型号TMS320DM6446的Datasheet PDF文件第3页浏览型号TMS320DM6446的Datasheet PDF文件第4页浏览型号TMS320DM6446的Datasheet PDF文件第5页浏览型号TMS320DM6446的Datasheet PDF文件第6页浏览型号TMS320DM6446的Datasheet PDF文件第7页 
TMS320DM6446  
Digital Media System-on-Chip  
www.ti.com  
SPRS283E–DECEMBER 2005–REVISED MARCH 2007  
1 Digital Media System-on-Chip (DMSoC)  
1.1 Features  
•
High-Performance Digital Media SoC  
•
ARM926EJ-S Core  
–
–
–
–
–
594-MHz C64x+™ Clock Rate  
297-MHz ARM926EJ-S™ Clock Rate  
Eight 32-Bit C64x+ Instructions/Cycle  
4752 C64x+ MIPS  
Fully Software-Compatible With C64x /  
ARM9™  
–
Support for 32-Bit and 16-Bit (Thumb®  
Mode) Instruction Sets  
DSP Instruction Extensions and Single  
Cycle MAC  
ARM® Jazelle® Technology  
EmbeddedICE-RT™ Logic for Real-Time  
Debug  
–
–
–
•
Advanced Very-Long-Instruction-Word (VLIW)  
TMS320C64x+™ DSP Core  
–
•
•
ARM9 Memory Architecture  
–
–
–
–
16K-Byte Instruction Cache  
8K-Byte Data Cache  
16K-Byte RAM  
Eight Highly Independent Functional Units  
•
Six ALUs (32-/40-Bit), Each Supports  
Single 32-Bit, Dual 16-Bit, or Quad 8-Bit  
Arithmetic per Clock Cycle  
8K-Byte ROM  
•
Two Multipliers Support Four 16 x 16-Bit  
Multiplies (32-Bit Results) per Clock  
Cycle or Eight 8 x 8-Bit Multiplies (16-Bit  
Results) per Clock Cycle  
Embedded Trace Buffer™ (ETB11™) With 4KB  
Memory for ARM9 Debug  
•
•
Endianness: Little Endian for ARM and DSP  
Video Processing Subsystem  
–
–
Load-Store Architecture With Non-Aligned  
Support  
Front End Provides:  
•
•
CCD and CMOS Imager Interface  
BT.601/BT.656 Digital YCbCr 4:2:2  
(8-/16-Bit) Interface  
Preview Engine for Real-Time Image  
Processing  
Glueless Interface to Common Video  
Decoders  
Histogram Module  
Auto-Exposure, Auto-White Balance and  
Auto-Focus Module  
–
–
–
–
64 32-Bit General-Purpose Registers  
Instruction Packing Reduces Code Size  
All Instructions Conditional  
•
•
Additional C64x+™ Enhancements  
•
•
Protected Mode Operation  
Exceptions Support for Error Detection  
and Program Redirection  
•
•
•
Hardware Support for Modulo Loop  
Operation  
•
C64x+ Instruction Set Features  
•
Resize Engine  
–
–
–
–
–
–
Byte-Addressable (8-/16-/32-/64-Bit Data)  
8-Bit Overflow Protection  
Bit-Field Extract, Set, Clear  
Normalization, Saturation, Bit-Counting  
Compact 16-Bit Instructions  
Additional Instructions to Support Complex  
Multiplies  
•
•
Resize Images From 1/4x to 4x  
Separate Horizontal/Vertical Control  
–
Back End Provides:  
•
•
Hardware On-Screen Display (OSD)  
Four 54-MHz DACs for a Combination of  
•
•
Composite NTSC/PAL Video  
Luma/Chroma Separate Video  
(S-video)  
•
C64x+ L1/L2 Memory Architecture  
–
–
–
32K-Byte L1P Program RAM/Cache (Direct  
Mapped)  
80K-Byte L1D Data RAM/Cache (2-Way  
Set-Associative)  
64K-Byte L2 Unified Mapped RAM/Cache  
(Flexible RAM/Cache Allocation)  
•
Component (YPbPr or RGB) Video  
(Progressive)  
•
Digital Output  
•
•
•
8-/16-bit YUV or up to 24-Bit RGB  
HD Resolution  
Up to 2 Video Windows  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2005–2007, Texas Instruments Incorporated  
 
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