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TMS320C6727BGDHA350 PDF预览

TMS320C6727BGDHA350

更新时间： 2024-10-29 05:55:03
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德州仪器 - TI 数字信号处理器
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118页 1374K
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Floating-Point Digital Signal Processors

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TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720  
Floating-Point Digital Signal Processors  
www.ti.com  
SPRS370E–SEPTEMBER 2006–REVISED JULY 2008  
1 TMS320C6727B, TMS320C6726B, TMS320C6722B, TMS320C6720 DSPs  
1.1 Features  
•
•
C672x: 32-/64-Bit 350-MHz Floating-Point DSPs  
•
Three Multichannel Audio Serial Ports  
–
–
–
–
Transmit/Receive Clocks up to 50 MHz  
Six Clock Zones and 16 Serial Data Pins  
Supports TDM, I2S, and Similar Formats  
DIT-Capable (McASP2)  
Upgrades to C67x+ CPU From C67x™ DSP  
Generation:  
–
–
–
2X CPU Registers [64 General-Purpose]  
New Audio-Specific Instructions  
Compatible With the C67x CPU  
•
•
Universal Host-Port Interface (UHPI)  
–
–
32-Bit-Wide Data Bus for High Bandwidth  
Muxed and Non-Muxed Address and Data  
•
•
Enhanced Memory System  
–
–
–
–
256K-Byte Unified Program/Data RAM  
384K-Byte Unified Program/Data ROM  
Single-Cycle Data Access From CPU  
Large Program Cache (32K Byte) Supports  
RAM, ROM, and External Memory  
Two 10-MHz SPI Ports With 3-, 4-, and 5-Pin  
Options  
•
•
•
•
Two Inter-Integrated Circuit (I2C) Ports  
Real-Time Interrupt Counter/Watchdog  
Oscillator- and Software-Controlled PLL  
Applications:  
External Memory Interface (EMIF) Supports  
–
–
133-MHz SDRAM (16- or 32-Bit)  
Asynchronous NOR Flash, SRAM (8-,16-, or  
32-Bit)  
–
Professional Audio  
•
•
•
•
•
•
•
Mixers  
Effects Boxes  
–
NAND Flash (8- or 16-Bit)  
•
•
Enhanced I/O System  
Audio Synthesis  
Instrument/Amp Modeling  
Audio Conferencing  
Audio Broadcast  
Audio Encoder  
–
–
–
High-Performance Crossbar Switch  
Dedicated McASP DMA Bus  
Deterministic I/O Performance  
dMAX (Dual Data Movement Accelerator)  
Supports:  
–
–
–
–
Emerging Audio Applications  
Biometrics  
Medical  
–
–
16 Independent Channels  
Concurrent Processing of Two Transfer  
Requests  
Industrial  
–
1-, 2-, and 3-Dimensional  
Memory-to-Memory and  
•
•
Commercial or Extended Temperature  
Memory-to-Peripheral Data Transfers  
144-Pin, 0.5-mm, PowerPAD™ Thin Quad  
Flatpack (TQFP) [RFP Suffix]  
–
–
Circular Addressing Where the Size of a  
Circular Buffer (FIFO) is not Limited to 2n  
Table-Based Multi-Tap Delay Read and  
Write Transfers From/To a Circular Buffer  
•
256-Terminal, 1.0-mm, 16x16 Array Plastic Ball  
Grid Array (PBGA) [GDH and ZDH Suffixes]  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this document.  
C67x, PowerPAD, TMS320C6000, C6000, DSP/BIOS, XDS, TMS320 are trademarks of Texas Instruments.  
Philips is a registered trademark of Koninklijki Philips Electronics N.V.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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