是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | CSP |
包装说明: | HFBGA, BGA532,26X26,32 | 针数: | 532 |
Reach Compliance Code: | compliant | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 1.57 | 地址总线宽度: | 20 |
桶式移位器: | NO | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 75 MHz |
外部数据总线宽度: | 64 | 格式: | FIXED POINT |
集成缓存: | YES | 内部总线架构: | MULTIPLE |
JESD-30 代码: | S-PBGA-B532 | JESD-609代码: | e1 |
长度: | 23 mm | 低功率模式: | YES |
湿度敏感等级: | 4 | DMA 通道数量: | 64 |
外部中断装置数量: | 4 | 端子数量: | 532 |
计时器数量: | 3 | 片上程序ROM宽度: | 8 |
最高工作温度: | 105 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HFBGA |
封装等效代码: | BGA532,26X26,32 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, HEAT SINK/SLUG, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 1.2,3.3 V | 认证状态: | Not Qualified |
RAM(字数): | 4096 | ROM可编程性: | FLASH |
座面最大高度: | 3.25 mm | 子类别: | Digital Signal Processors |
最大供电电压: | 1.24 V | 最小供电电压: | 1.16 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 23 mm |
uPs/uCs/外围集成电路类型: | DIGITAL SIGNAL PROCESSOR, OTHER | Base Number Matches: | 1 |
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