Datasheet > TMS10S

TMS10S

更新时间： 2024-11-04 05:34:47

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描述
超薄型。表面贴装型。桥式整流器。海鸥型引出脚。厚度仅1.4MM。玻璃钝化芯片。

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中文翻译

获取价格

数据手册

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TMS10S 数据手册

表面贴装整流桥 TMB05S thru TMB10S

Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifier

Reverse Voltage 50 to 1000V Forward Current 0.8A

FEATURES

表面贴装应用

超薄塑料封装（1.4MM）

玻璃钝化芯片

高浪涌电流 30A

最高焊接温度 260℃ /10 秒

MECHANICAL DATA

封装: 塑料封装:

焊接端子: 锡镀层

包装: 5 K / Reel（13”） 100K/箱

重量: 0.102g

MAXIMUM RATINGS AND THERMAL CHARACTERISTICS

Ratings at 25℃ ambient temperature unless otherwise specified.

Symbols

TMB05S TMB1S TMB2S TMB4S TMB6S TMB8S TMB10S

Units

Volts

Maximum recurrent peak reverse Voltage

Maximum RMS voltage

V_RRM

V_RMS

V_DC

100

200

140

200

400

280

400

600

420

600

800

560

800

1000

700

Maximum DC blocking voltage

100

1000

Maximum average forward output rectified current

(see Fig :1)

on glass-epoxy P.C.B. (1)

on aluminum substrate (2)

I_F(AV)

I_FSM

V_F

0.5

0.8

Amps

Volts

Peak forward surge current 8.3ms single half

sine-wave superimposed on rated load (JEDEC

Method)

30.0

Maximum instantaneous forward voltage drop per leg

at 0.4A

1.0

5.0

Maximum DC reverse current T_A=25℃

at rated DC blocking voltage T_A=125℃

Rating for fusing (t<8.3ms)

I_R

100.0

5.0

μA

A²sec

I²t

Typical junction capacitance per leg at 4.0V.1MHz

Typical thermal resistance per leg

C_J

13.0

RΘJL

RΘJA

T_JT_STG

20.0

85.0⁽¹⁾

70.0⁽²⁾

-55 to+150

℃/W

Operating junction and storage temperature range

NOTES:

℃

1. On glass epoxy P.C.B. mounted on0.05*0.05”(1.3*1.3mm)pads

2. On aluminum substrate P.C.B. with an area of 0.8”(20*20mm) mounted

中文翻译

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