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TMP95CU54AF PDF预览

TMP95CU54AF

更新时间： 2024-11-17 22:17:59
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
48页 385K
描述
Quality And Reliability Assurance / Handling Precautions

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中文翻译

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TMP95CU54AF 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：QFP包装说明：LFQFP, QFP100(UNSPEC)
针数：100Reach Compliance Code：unknown
HTS代码：8542.31.00.01风险等级：5.92
具有ADC：YES地址总线宽度：24
位大小：16CPU系列：TLCS-900/H
最大时钟频率：24 MHzDAC 通道：NO
DMA 通道：YES外部数据总线宽度：16
JESD-30 代码：S-PQFP-G100JESD-609代码：e0
长度：14 mmI/O 线路数量：81
端子数量：100最高工作温度：85 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：PLASTIC/EPOXY封装代码：LFQFP
封装等效代码：QFP100(UNSPEC)封装形状：SQUARE
封装形式：FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度（摄氏度）：NOT SPECIFIED
电源：5 V认证状态：Not Qualified
RAM（字节）：3072ROM（单词）：49152
ROM可编程性：MROM座面最大高度：1.6 mm
速度：24 MHz子类别：Microcontrollers
最大压摆率：85 mA最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：GULL WING端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：14 mmuPs/uCs/外围集成电路类型：MICROCONTROLLER
Base Number Matches：1

TMP95CU54AF 数据手册

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Quality and Reliability Assurance / Handling Precautions  
Quality And Reliability Assurance / Handling Precautions  
In recent years, technical revolutions have become almost a daily occurrence in the  
electronics industry. This is accompanied by the increasing application of semiconductors in  
both the consumer and industrial sectors, and demands for higher quality and higher  
reliability.  
Toshiba is making every effort to improve both quality and reliability with the following  
quality control system which incorporates product design, quality assurance for parts and  
materials received, manufacturing process quality assurance, shipping quality and  
reliability assurance, and quality after-service based on user demands and market survey  
data.  
1 Quality And Reliability Assurance  
1.1 Quality Assurance  
Trying to sense the customer’s needs, we do our best to incorporate the quality and  
reliability required by the customer into the design, while considering the safety  
and PL (Product Liability) of the products.  
Quality and reliability evaluation are performed on the developed products  
according to the Toshiba’s reliability test standard which is prepared in conformity  
with JIS, EIAJ, MIL, etc., thereby certifying the design. The parts and materials  
are standardized through the engineering department and the quality assurance  
department. After the design is accepted, standardization is performed by the  
engineering department on the parts and materials, process plan, and inspection  
plan. Engineering Institution of Works (EW) is then established on the working  
detail. The quality and reliability evaluation are performed on the mass-produced  
products on an experimental basis.  
In the mass production, the production department has control of the  
manufacturing process, the environment and facility, and the quality assurance  
department. Quality assurance performs incoming inspection of parts and  
materials, modification control, instrument control, periodical reliability test and  
line audit. The production technology divisions also participate in process  
improvement, automatization, etc.  
Education and training for quality and reliability, are given to new workers,  
inspectors, engineers and small groups (QC/ZD movement). In shipping the  
finished products, a lot quality assurance test is performed by the quality assurance  
department. We then commence preparation of specifications meeting pre-arranged  
quality and reliability standards and the inspection and reports on discrepant  
products “quick action” as the motto. Figure 1 shows the quality assurance system  
of semiconductor.  
030901  
QUA-1  
2002-02-20  
1234567...48

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