TMP93PS44F

更新时间： 2024-11-19 22:25:27

品牌	Logo	应用领域
东芝 - TOSHIBA		微控制器和处理器外围集成电路可编程只读存储器时钟
页数	文件大小	规格书
48页	385K
描述
Quality And Reliability Assurance / Handling Precautions

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TMP93PS44F 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	QFP	包装说明：	LFQFP, QFP80,.55SQ,20
针数：	80	Reach Compliance Code：	unknown
HTS代码：	8542.31.00.01	风险等级：	5.88
Is Samacsys：	N	具有ADC：	YES
其他特性：	OPERATES AT 2.7V MINIMUM SUPPLY @ 12.5MHZ	地址总线宽度：	24
位大小：	16	CPU系列：	TLCS-900/L
最大时钟频率：	20 MHz	DAC 通道：	NO
DMA 通道：	NO	外部数据总线宽度：	16
JESD-30 代码：	S-PQFP-G80	JESD-609代码：	e0
长度：	12 mm	I/O 线路数量：	62
端子数量：	80	最高工作温度：	85 °C
最低工作温度：	-40 °C	PWM 通道：	YES
封装主体材料：	PLASTIC/EPOXY	封装代码：	LFQFP
封装等效代码：	QFP80,.55SQ,20	封装形状：	SQUARE
封装形式：	FLATPACK, LOW PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	3/5 V	认证状态：	Not Qualified
RAM（字节）：	2048	ROM（单词）：	65536
ROM可编程性：	OTPROM	座面最大高度：	1.6 mm
速度：	20 MHz	子类别：	Microcontrollers
最大压摆率：	25 mA	最大供电电压：	5.5 V
最小供电电压：	4.5 V	标称供电电压：	5 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	GULL WING	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	12 mm	uPs/uCs/外围集成电路类型：	MICROCONTROLLER
Base Number Matches：	1

TMP93PS44F 数据手册

Quality and Reliability Assurance / Handling Precautions

Quality And Reliability Assurance / Handling Precautions

In recent years, technical revolutions have become almost a daily occurrence in the

electronics industry. This is accompanied by the increasing application of semiconductors in

both the consumer and industrial sectors, and demands for higher quality and higher

reliability.

Toshiba is making every effort to improve both quality and reliability with the following

quality control system which incorporates product design, quality assurance for parts and

materials received, manufacturing process quality assurance, shipping quality and

reliability assurance, and quality after-service based on user demands and market survey

data.

1 Quality And Reliability Assurance

1.1 Quality Assurance

Trying to sense the customer’s needs, we do our best to incorporate the quality and

reliability required by the customer into the design, while considering the safety

and PL (Product Liability) of the products.

Quality and reliability evaluation are performed on the developed products

according to the Toshiba’s reliability test standard which is prepared in conformity

with JIS, EIAJ, MIL, etc., thereby certifying the design. The parts and materials

are standardized through the engineering department and the quality assurance

department. After the design is accepted, standardization is performed by the

engineering department on the parts and materials, process plan, and inspection

plan. Engineering Institution of Works (EW) is then established on the working

detail. The quality and reliability evaluation are performed on the mass-produced

products on an experimental basis.

In the mass production, the production department has control of the

manufacturing process, the environment and facility, and the quality assurance

department. Quality assurance performs incoming inspection of parts and

materials, modification control, instrument control, periodical reliability test and

line audit. The production technology divisions also participate in process

improvement, automatization, etc.

Education and training for quality and reliability, are given to new workers,

inspectors, engineers and small groups (QC/ZD movement). In shipping the

finished products, a lot quality assurance test is performed by the quality assurance

department. We then commence preparation of specifications meeting pre-arranged

quality and reliability standards and the inspection and reports on discrepant

products “quick action” as the motto. Figure 1 shows the quality assurance system

of semiconductor.

030901

QUA-1

2002-02-20

12 3 4 5 6 7...48

中文翻译

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TMP93PW44ADF	TOSHIBA	获取价格	Quality And Reliability Assurance / Handling Precautions

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