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TM4EN64NPU-50 PDF预览

TM4EN64NPU-50

更新时间: 2024-10-01 21:00:43
品牌 Logo 应用领域
德州仪器 - TI 动态存储器内存集成电路
页数 文件大小 规格书
20页 292K
描述
4MX64 EDO DRAM MODULE, 50ns, DMA168, DIMM-168

TM4EN64NPU-50 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM168针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.84
访问模式:FAST PAGE WITH EDO最长访问时间:50 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型:COMMON
JESD-30 代码:R-XDMA-N168内存密度:268435456 bit
内存集成电路类型:EDO DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:168字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX64输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM168封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:3.3 V
认证状态:Not Qualified刷新周期:8192
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.52 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:MOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

TM4EN64NPU-50 数据手册

 浏览型号TM4EN64NPU-50的Datasheet PDF文件第2页浏览型号TM4EN64NPU-50的Datasheet PDF文件第3页浏览型号TM4EN64NPU-50的Datasheet PDF文件第4页浏览型号TM4EN64NPU-50的Datasheet PDF文件第5页浏览型号TM4EN64NPU-50的Datasheet PDF文件第6页浏览型号TM4EN64NPU-50的Datasheet PDF文件第7页 
TM4EN64KPU, TM4EN64NPU 4194304 BY 64-BIT  
TM8EN64KPU, TM8EN64NPU 8388608 BY 64-BIT  
EXTENDED-DATA-OUT DYNAMIC RAM MODULES  
SMMS692 – AUGUST 1997  
Organization  
Long Refresh Periods:  
– TM4EN64xPU-xx . . . 4194304 × 64 Bits  
– TM8EN64xPU-xx . . . 8388608 × 64 Bits  
– TMxEN64KPU: 64 ms (4096 Cycles)  
– TMxEN64NPU: 64 ms (8192 Cycles)  
Single 3.3-V Power Supply  
3-State Output  
(±10% Tolerance)  
Extended-Data-Out (EDO) Operation With  
CAS-Before-RAS (CBR), RAS-Only, and  
Hidden Refresh  
JEDEC 168-Pin Dual-In-Line Memory  
Module (DIMM) Without Buffer for Use With  
Socket  
Serial-Presence-Detect (SPD) Using  
EEPROM  
TM4EN64xPU-xx — Utilizes Four 64M-Bit  
High-Speed (4M×16-Bit) Dynamic RAMs  
Ambient Temperature Range  
TM8EN64xPU-xx — Utilizes Eight 64M-Bit  
0°C to 70°C  
High-Speed (4M×16-Bit) Dynamic RAMs  
Gold-Plated Contacts  
High-Speed, Low-Noise LVTTL Interface  
Performance Ranges  
High-Reliability 50-Lead 400-Mil-Wide  
Surface-Mount Thin Small-Outline Package  
(TSOP) (DGE Suffix)  
ACCESS ACCESS ACCESS EDO  
TIME  
TIME  
TIME CYCLE  
t
t
t
t
HPC  
RAC  
CAC  
AA  
(MAX)  
’xEN64xPU–40 40 ns  
’xEN64xPU–50 50 ns  
’xEN64xPU–60 60 ns  
(MAX)  
11 ns  
13 ns  
15 ns  
(MAX)  
20 ns  
25 ns  
30 ns  
(MIN)  
16 ns  
20 ns  
25 ns  
description  
TheTM4EN64KPUisa32M-byte, 168-pin, dual-in-linememorymodule(DIMM). TheDIMMiscomposedoffour  
TMS465169, 4194304 × 16-bit 4K-refresh EDO dynamic random-access memory (DRAM) devices, each in a  
400-mil, 50-pin plastic thin small-outline package (TSOP) (DGE suffix) mounted on a substrate with decoupling  
capacitors. See the TMS465169 data sheet (literature number SMHS566).  
The TM4EN64NPU is a 32M-byte, 168-pin DIMM. The DIMM is composed of four TMS464169,  
4194304 × 16-bit 8K-refresh EDO DRAMs, each in a 400-mil, 50-pin plastic TSOP (DGE suffix) mounted on  
a substrate with decoupling capacitors. See the TMS464169 data sheet (literature number SMHS566).  
The TM8EN64KPU is a 64M-byte ,168-pin DIMM. The DIMM is composed of eight TMS465169, 41934304 ×  
16-bit 4K-refresh EDO DRAMs, each in a 400-mil, 50-pin plastic TSOP (DGE suffix) mounted on a substrate  
with decoupling capacitors. See the TMS465169 data sheet (literature number SMHS566).  
The TM8EN64NPU is a 64M-byte ,168-pin DIMM. The DIMM is composed of eight TMS464169, 41934304 ×  
16-bit 8K-refresh EDO DRAMs, each in a 400-mil, 50-pin plastic TSOP (DGE suffix) mounted on a substrate  
with decoupling capacitors. See the TMS464169 data sheet (literature number SMHS566).  
operation  
The TM4EN64xPU operates as four TMS46x169s that are connected as shown in the TM4EN64xPU functional  
block diagram. The TM8EN64xPU operates as 18 TMS46x169s that are connected as shown in the  
TM8EN64xPU functional block diagram.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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