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SMMS686A − AUGUST 1997 − REVISED FEBRUARY 1998
D
D
D
Organization . . . 4194304 × 72 Bits
Single 3.3-V Power Supply
( 10% Tolerance)
D
Long Refresh Periods:
− TM4EP72CxB: 64 ms (4096 Cycles)
− TM4EP72BxB: 32 ms (2048 Cycles)
D
D
3-State Output
JEDEC 168-Pin Dual-In-Line Memory
Module (DIMM) With Buffer for Use With
Socket
Extended-Data-Out (EDO) Operation With
CAS-Before-RAS (CBR), RAS-Only, and
Hidden Refresh
D
TM4EP72xxB-xx — Uses Eighteen 16M-Bit
High-Speed (4M×4-Bit) Dynamic Random
Access Memories (DRAMs)
D
Ambient Temperature Range
0°C to 70°C
D
D
High-Speed, Low-Noise LVTTL Interface
D
Gold-Plated Contacts
High-Reliability Plastic 26-Lead
D
Performance Ranges
300-Mil-Wide Surface-Mount Small-Outline
J-Lead (SOJ) Package (DJ Suffix) and
26-Lead 300-Mil-Wide Surface-Mount Thin
ACCESS ACCESS ACCESS EDO
TIME
TIME
TIME CYCLE
t
t
t
t
HPC
RAC
CAC
AA
Small-Outline Package (TSOP) (DGA Suffix)
(MAX)
50 ns
60 ns
70 ns
(MAX)
13 ns
15 ns
18 ns
(MAX)
25 ns
30 ns
35 ns
(MIN)
20 ns
25 ns
30 ns
’4EP72xxB-50
’4EP72xxB-60
’4EP72xxB-70
D
Intended for Workstation/Server
Applications
description
The TM4EP72BxB is a 32M-byte, 168-pin, buffered, dual-in-line memory module (DIMM). The DIMM is
composed of eighteen TMS427409A, 4194304 × 4-bit 2K refresh EDO DRAMs, each in a 300-mil, 26-lead
plastic TSOP (DGA suffix) or SOJ package (DJ suffix), and two SN74LVT162244 16-bit buffers, each in a
48-lead plastic TSOP mounted on a substrate with decoupling capacitors. See the TMS427409A data sheet
(literature number SMKS893).
The TM4EP72CxB is a 32M-byte, 168-pin, buffered DIMM. The DIMM is composed of eighteen TMS426409A,
4194304 × 4-bit 4K refresh EDO DRAMs, each in a 300-mil, 26-lead plastic TSOP (DGA suffix) or SOJ package
(DJ suffix), and two 16-bit buffers mounted on a substrate with decoupling capacitors. See the TMS427409A
data sheet (literature number SMKS893).
These modules are intended for multimodule workstation/server applications where buffering is needed for
address and control signals. Two copies of address 0 (A0 and B0) are defined to allow maximum performance
for 4-byte applications which interleave between two 4-byte banks. A0 is common to the DRAMs used for
DQ0−DQ31, while B0 is common to the DRAMs used for DQ32−DQ63.
operation
The TM4EP72xxB operates as eighteen TMS42x409As that are connected as shown in the TM4EP72xxB
functional block diagram.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 1998, Texas Instruments Incorporated
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ꢤ ꢨ ꢥ ꢤꢝ ꢞꢲ ꢠꢟ ꢣ ꢫꢫ ꢩꢣ ꢡ ꢣ ꢢ ꢨ ꢤ ꢨ ꢡ ꢥ ꢭ
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1
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