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TM4EP72BJB-60 PDF预览

TM4EP72BJB-60

更新时间: 2024-01-26 08:59:18
品牌 Logo 应用领域
德州仪器 - TI 动态存储器内存集成电路
页数 文件大小 规格书
13页 236K
描述
4MX72 EDO DRAM MODULE, 60ns, DMA168, DIMM-168

TM4EP72BJB-60 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM168针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.28风险等级:5.84
访问模式:FAST PAGE WITH EDO最长访问时间:60 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型:COMMON
JESD-30 代码:R-XDMA-N168内存密度:301989888 bit
内存集成电路类型:EDO DRAM MODULE内存宽度:72
功能数量:1端口数量:1
端子数量:168字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX72输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM168封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:3.3 V
认证状态:Not Qualified刷新周期:2048
座面最大高度:25.4 mm自我刷新:NO
最大待机电流:0.018 A子类别:Other Memory ICs
最大压摆率:1.8 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

TM4EP72BJB-60 数据手册

 浏览型号TM4EP72BJB-60的Datasheet PDF文件第2页浏览型号TM4EP72BJB-60的Datasheet PDF文件第3页浏览型号TM4EP72BJB-60的Datasheet PDF文件第4页浏览型号TM4EP72BJB-60的Datasheet PDF文件第5页浏览型号TM4EP72BJB-60的Datasheet PDF文件第6页浏览型号TM4EP72BJB-60的Datasheet PDF文件第7页 
TM4EP72BPB, TM4EP72BJB, 4194304 BY 72-BIT  
TM4EP72CPB, TM4EP72CJB 4194304 BY 72-BIT  
EXTENDED-DATA-OUT BUFFERED DYNAMIC RAM MODULES  
SMMS686A – AUGUST 1997 – REVISED FEBRUARY 1998  
Organization . . . 4194304 × 72 Bits  
Long Refresh Periods:  
– TM4EP72CxB: 64 ms (4096 Cycles)  
– TM4EP72BxB: 32 ms (2048 Cycles)  
Single 3.3-V Power Supply  
(±10% Tolerance)  
3-State Output  
JEDEC 168-Pin Dual-In-Line Memory  
Module (DIMM) With Buffer for Use With  
Socket  
Extended-Data-Out (EDO) Operation With  
CAS-Before-RAS (CBR), RAS-Only, and  
Hidden Refresh  
TM4EP72xxB-xx — Uses Eighteen 16M-Bit  
High-Speed (4M×4-Bit) Dynamic Random  
Access Memories (DRAMs)  
Ambient Temperature Range  
0°C to 70°C  
High-Speed, Low-Noise LVTTL Interface  
Gold-Plated Contacts  
High-Reliability Plastic 26-Lead  
Performance Ranges  
300-Mil-Wide Surface-Mount Small-Outline  
J-Lead (SOJ) Package (DJ Suffix) and  
26-Lead 300-Mil-Wide Surface-Mount Thin  
Small-Outline Package (TSOP) (DGA Suffix)  
ACCESS ACCESS ACCESS EDO  
TIME  
TIME  
TIME CYCLE  
t
t
t
t
HPC  
RAC  
CAC  
AA  
(MAX)  
50 ns  
60 ns  
70 ns  
(MAX)  
13 ns  
15 ns  
18 ns  
(MAX)  
25 ns  
30 ns  
35 ns  
(MIN)  
20 ns  
25 ns  
30 ns  
’4EP72xxB-50  
’4EP72xxB-60  
’4EP72xxB-70  
Intended for Workstation/Server  
Applications  
description  
The TM4EP72BxB is a 32M-byte, 168-pin, buffered, dual-in-line memory module (DIMM). The DIMM is  
composed of eighteen TMS427409A, 4194304 × 4-bit 2K refresh EDO DRAMs, each in a 300-mil, 26-lead  
plastic TSOP (DGA suffix) or SOJ package (DJ suffix), and two SN74LVT162244 16-bit buffers, each in a  
48-lead plastic TSOP mounted on a substrate with decoupling capacitors. See the TMS427409A data sheet  
(literature number SMKS893).  
The TM4EP72CxB is a 32M-byte, 168-pin, buffered DIMM. The DIMM is composed of eighteen TMS426409A,  
4194304 × 4-bit 4K refresh EDO DRAMs, each in a 300-mil, 26-lead plastic TSOP (DGA suffix) or SOJ package  
(DJ suffix), and two 16-bit buffers mounted on a substrate with decoupling capacitors. See the TMS427409A  
data sheet (literature number SMKS893).  
These modules are intended for multimodule workstation/server applications where buffering is needed for  
address and control signals. Two copies of address 0 (A0 and B0) are defined to allow maximum performance  
for 4-byte applications which interleave between two 4-byte banks. A0 is common to the DRAMs used for  
DQ0–DQ31, while B0 is common to the DRAMs used for DQ32–DQ63.  
operation  
The TM4EP72xxB operates as eighteen TMS42x409As that are connected as shown in the TM4EP72xxB  
functional block diagram.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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